Abstract: A plasma processing apparatus includes a first chamber having a first wall with an inner peripheral surface and an outlet. A plurality of fluid supplying outlets are disposed along the first wall and are configured to supply a cooling fluid into the first chamber that travels in a circumferential direction around the inner peripheral surface of the first wall and in a direction towards the outlet. The cooling fluid exiting the plurality of fluid supplying outlets forms a cooling layer for cooling the inner peripheral surface of the first wall, and the outlet is configured for allowing the cooling fluid to exit therethrough while retaining the plasma within the chamber.
Type:
Grant
Filed:
May 10, 2000
Date of Patent:
June 22, 2004
Assignee:
Essox Research and Development, Inc.
Inventors:
Michael Fraim, Rick B. Spielman, Robert R. Schiewe