Patents Assigned to Estec Co., Ltd.
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Patent number: 6774761Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 48 to 60% In, 10 to 25% Sn, and the balance Bi, and a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Ag, Cu, Ni, and Pd is added to 100 weight parts of the composition. As a result, the operating temperature is in the range of 57 to 67° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.Type: GrantFiled: March 4, 2003Date of Patent: August 10, 2004Assignee: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20040143183Abstract: The present invention relates to a device for detecting a position and an orientation of an insertion portion of a medical insertion tool which is inserted inside a body cavity, from the outside, and a detecting method therefor. An object of the present invention can achieve a downsized and lightweight insertion portion so as to be smoothly and easily insertable into even a narrow body cavity such as a blood vessel inside a skull, without having a bad influence on a vital tissue. Moreover, another object thereof is to make it possible to detect the three-dimensional position and orientation of the insertion tool very accurately while minimizing a noise. According to the present invention, a permanent magnet or a ferromagnetic body 4 is attached to an insertion portion 2 of a catheter 1 as an example of the medical insertion tool, which is inserted into the body cavity.Type: ApplicationFiled: October 29, 2003Publication date: July 22, 2004Applicants: Uchihashi Estec Co., Ltd., Ken IkeuchiInventors: Kazumi Toyoda, Tomoki Okazaki, Ken Ikeuchi
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Publication number: 20040100353Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation safety after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 46% and 70% or smaller, Bi is 1% or larger and 12% or smaller, and In is 18% or larger and smaller than 48% is used.Type: ApplicationFiled: September 3, 2003Publication date: May 27, 2004Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20040100355Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation stability after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 25% and 44% or smaller, Bi is 1% or larger and smaller than 20%, and In is larger than 55% and 74% or smaller is used.Type: ApplicationFiled: September 4, 2003Publication date: May 27, 2004Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20040100352Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation stability after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 25% and 60% or smaller, Bi is larger than 12% and 33% or smaller, and In is 20% or larger and smaller than 50% is used.Type: ApplicationFiled: September 4, 2003Publication date: May 27, 2004Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20040085178Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, the operating temperature belongs to the range of 130 to 170° C., the overload characteristic and the dielectric breakdown characteristic are excellent, the insulation stability after an operation can be sufficiently ensured, and thinning of a fuse element can be easily realized. A fuse element having an alloy composition in which Sn is larger than 43% and 70% or smaller, In is 0.5% or higher and 10% or lower, and a balance is Bi is used.Type: ApplicationFiled: September 3, 2003Publication date: May 6, 2004Applicant: Uchihashi Estec Co., Ltd.Inventors: Yoshiaki Tanaka, Toshiaki Saruwatari
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Publication number: 20040066268Abstract: The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the operating temperature can be sufficiently suppressed, and the operation stability to a heat cycle can be satisfactorily assured. The thermal fuse has an alloy composition of 30 to 70% Sn, 0.3 to 20% Sb, and a balance Bi.Type: ApplicationFiled: June 27, 2003Publication date: April 8, 2004Applicant: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Publication number: 20040021499Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C.Type: ApplicationFiled: July 8, 2003Publication date: February 5, 2004Applicant: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Publication number: 20030206093Abstract: The present invention relates to an alloy type thermal fuse and a fuse element which are particularly useful as a thermoprotector for a battery. It is an object of the invention to provide an alloy type thermal fuse in which a ternary In—Sn—Bi alloy or an alloy in which Ag or Cu is added to the ternary alloy is used as a fuse element, or the fuse element wherein dispersion of the operating temperature can be satisfactorily suppressed, the operating temperature can be set to about 100° C. or lower, and the specific resistance and the mechanical strength of the fuse element can be sufficiently ensured. A low-melting fusible alloy serving as the fuse element has an alloy composition of 50 to 55% In, 25 to 40% Sn, and balance Bi. In a preferable range of the composition, In is 51 to 53%, Sn is 32 to 36%, and a balance is Bi.Type: ApplicationFiled: April 25, 2003Publication date: November 6, 2003Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshihito Hamada
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Publication number: 20030169144Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 48 to 60% In, 10 to 25% Sn, and the balance Bi, and a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Ag, Cu, Ni, and Pd is added to 100 weight parts of the composition. As a result, the operating temperature is in the range of 57 to 67° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.Type: ApplicationFiled: March 4, 2003Publication date: September 11, 2003Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20030170140Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Bi, Cu, Ni, and Pd is added to 100 weight parts of a composition of 100% In, that of 90 to 99.9% In and 0.1 to 10% Ag, or that of 95 to 99.9% In and 0.1 to 5% Sb. As a result, the operating temperature is in the range of 135 to 160° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, and the thermal stability can be satisfactorily guaranteed.Type: ApplicationFiled: March 4, 2003Publication date: September 11, 2003Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Publication number: 20030169143Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.Type: ApplicationFiled: March 4, 2003Publication date: September 11, 2003Applicant: Uchihashi Estec Co., Ltd.Inventor: Yoshiaki Tanaka
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Patent number: 6601984Abstract: An LED illuminating device that includes a light-guiding member formed of a translucent material; an LED element formed of at least one diode disposed on one end of the light-guiding member for emitting light therein; a light-emitting region along the length of the light-guiding member; and a plurality of grooves having a rectangular cross-section and formed in the circumferential surface of the light-guiding member at appropriate intervals in the axial direction. The present invention also provides an LED illuminating appliance of various configurations that employ the LED illuminating device as a light source.Type: GrantFiled: February 12, 2002Date of Patent: August 5, 2003Assignee: Estec Co., Ltd.Inventors: Yutaka Yamamoto, Atsushi Yuzuki, Kazuaki Saito
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Publication number: 20020131275Abstract: An LED illuminating device that includes a light-guiding member formed of a translucent material; an LED element formed of at least one diode disposed on one end of the light-guiding member for emitting light therein; a light-emitting region along the length of the light-guiding member; and a plurality of grooves having a rectangular cross-section and formed in the circumferential surface of the light-guiding member at appropriate intervals in the axial direction. The present invention also provides an LED illuminating appliance of various configurations that employ the LED illuminating device as a light source.Type: ApplicationFiled: February 12, 2002Publication date: September 19, 2002Applicant: ESTEC CO., LTD.Inventors: Yutaka Yamamoto, Atsushi Yuzuki, Kazuaki Saito
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Patent number: 6040754Abstract: A thin type thermal fuse is structured by a resin base film, a pair of belt-shaped lead conductors, a low melting-point fusible alloy piece, flux and a resin cover film. Tip portions of the pair of belt-shaped lead conductors is fixed on the resin base film. The low melting-point fusible alloy piece is coupled between the tip end portions of the belt-shaped lead conductors. The flux applied on the low melting-point fusible alloy piece. The resin cover film which is disposed on a one surface of the resin base film so that a space between said films at peripheries of both the resin cover film and the resin base film is sealed and a space between the resin cover film and the belt-shaped lead conductors is sealed. In the thin type thermal fuse, a relation of (V/L).sup.1/2 /d.ltoreq.1.Type: GrantFiled: February 26, 1999Date of Patent: March 21, 2000Assignee: Uchihashi Estec Co., Ltd.Inventor: Toshiro Kawanishi
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Patent number: 5982268Abstract: A thin type fuse of the present invention has a structure in which each tip portion of a pair of lead conductors is put out from one side of an insulating substrate film on to the other side thereof so as to keep watertightness, the tip portions of the lead conductors on the other side of the insulating substrate film are connected by a fuse element, and the other side of the insulating substrate film is covered with an insulating covering film which is in contact with the fuse element. The contact of the fuse element with the insulating covering film is surface contact and a flux is filled around said contact surface.Type: GrantFiled: March 31, 1998Date of Patent: November 9, 1999Assignee: Uchihashi Estec Co., LtdInventor: Toshiro Kawanishi