Abstract: A decoration film, a decorated molded device, and a decoration molding process are provided. The decoration film includes a carrier layer; a releasing layer disposed on the carrier layer; a protection layer, wherein the releasing layer is located between the protection layer and the carrier layer; a decoration pattern layer disposed on the carrier layer; an impact resisting layer disposed on the carrier layer; an adhesion layer disposed on the carrier layer, wherein the total film thickness of the adhesion layer and the impact resisting layer is 2 ?m to 20 ?m and the impact resisting layer and the decoration pattern layer are located between the protection and the adhesion layer.

Abstract: A decoration film including a carrier layer, a first stacked layer and a second stacked layer is provided. The first stacked layer is disposed on the carrier layer. The second stacked layer is disposed on the carrier layer. A releasing ability of the first stacked layer releasing from the carrier layer is different from that of the second stacked layer releasing from the carrier layer so that a decoration region and a predetermined film cutting region are defined on the carrier layer by the first stacked layer and the second stacked layer respectively.

Abstract: A decoration film and a method for manufacturing a decorated article are provided. The decoration film includes a supporting layer and a releasing layer. The releasing layer is disposed on the supporting layer. Here, a releasing material of the releasing layer includes extendable resin and a plurality of particles, and a side of the releasing layer, away from the supporting layer, has an undulating surface.

Abstract: A curing process for curing a decorated article is provided. The decorated article includes a substrate, an adhesion layer and a pattern layer disposed on the substrate, sequentially. Processing conditions of the curing process include the following: a temperature ranged between 50° C. to 180° C., a relative humidity ranged between 30% to 100%, and a processing time ranged between 6 hours to 72 hours. A decorated article and a method for manufacturing the decorated article are also provided. The method for manufacturing the decorated article includes bonding a decoration film onto a substrate, and curing the decoration film and the substrate with the curing process. The decorated article is manufactured with the method for manufacturing the decorated article.

Abstract: An electronic device, a decorated article, a decoration film, a manufacturing method for the decorated article and a manufacturing method for the decoration film are provided. The decoration film includes a substrate, a releasing layer formed on the substrate, a durable layer formed on the releasing layer, an antenna formed on the durable layer and an adhesive layer covering the durable layer and the antenna. The durable layer has an opening. The antenna covers the opening. The electronic device includes a casing and an electronic module disposed inside the casing. The casing includes a body, an antenna transferred on a surface of the body and a durable layer covering the surface of the body and part of the antenna. The durable layer has an opening, and other part of the antenna is exposed in the opening. The electronic module is electrically connected to the antenna.

Abstract: Decoration films and manufacturing methods for decorated articles are provided. One of the decoration films includes a substrate, a releasing layer formed on the substrate, an ink layer formed on whole surface of the releasing layer, and a first adhesive layer formed on part surface of the ink layer. Another one of the decoration films includes a substrate, a releasing layer formed on the substrate, and an adhesive ink layer formed on part surface of the releasing layer.

Abstract: A decoration film, a method of fabricating a decoration film, and a method of fabricating a decoration device are provided. The decoration film includes a substrate and a relief pattern layer disposed on the substrate. The relief pattern layer has a relief surface away from the substrate and includes a decoration relief portion and a marker relief portion located around the decoration relief portion, wherein the relief pattern layer is remained on the substrate after the decoration process.

Abstract: A method of forming a partial deposition layer and an apparatus of forming the partial deposition layer are provided. A substrate is provided over an evaporation plate. A shielding plate is placed between the evaporation plate and the substrate such that the shielding plate shields a first portion of the substrate and exposes a second portion of the substrate. An evaporation process is performed when the substrate is moving in a predetermined direction such that a evaporation source on the evaporation plate is deposited on the exposed second portion of the substrate but not deposited on the shielded first portion of the substrate.

Abstract: A continuous decoration transferring and punching apparatus and process thereof which is capable to continuously form a plurality of decorated products is provided. The continuous decoration transferring and punching apparatus includes a first roll feeder for providing a substrate, a second roll feeder for providing a plurality of decoration films, a transferring unit for continuously transferring the decoration films to the substrate and a punching unit for continuously punching the substrate after the decoration films are transferred to the substrate for forming a plurality of decorated pieces. By using the roll feeders to synchronously and continuously transfer the decoration films to the substrate, a large amount of decoration transferred substrates can be obtained at the same time. Moreover, a plurality of decorated pieces can be accomplished through the utilizing of a following punching operation after the transferring process.

Abstract: A decoration film including a carrier layer, a releasing layer disposed on the carrier layer, and a protection layer disposed on a side of the releasing layer away from the carrier layer is provided. In addition, a decorated molded device including a housing, an adhesion layer disposed on the housing, and a protection layer disposed on the adhesion layer and located at a side of the adhesion layer away from the housing is also provided. The protection layer has a compressible depth of at least 2 ?m to 10 ?m under a compression stress of 10 mN for providing soft touch feel.

Abstract: This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material.

Abstract: An decorated device including a first body, a second body, a first decoration layer, and a second decoration layer is provided. The second body is disposed beside the first body. The first decoration layer contacts with the first body. The second decoration layer contacts with the second body, wherein the first body contacts with at least two of the second body, the first decoration layer, and the second decoration layer.

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.