Abstract: The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5 and Y? are as defined in the specification. The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Abstract: A coating composition is provided. The coating composition comprises (a) an aluminum oxide precursor and (b) a solvent, wherein the aluminum oxide precursor (a) comprises aluminum elements and the following groups bound thereon: (a1) a —OR1 group, wherein R1 is H or a substituted or unsubstituted C1 to C13 alkyl; (a2) a bidentate chelating group; and (a3) a tetrahedral coordinating group, wherein, the amount of the aluminum oxide precursor (a) is about 1 wt % to about 50 wt %, based on the total weight of the composition, and the total amount of the groups (a1), (a2) and (a3) is no more than 3 moles per 1 mole of the aluminum elements. The coating composition can be used in a semiconductor process for providing a passivation layer.

Abstract: An electrolytic material formulation and a polymer polymerized therefrom are provided. The formulation includes: (a) a monomer of formula (I); and (b) a monomer of formula (II), wherein, A, X, B1, B2, R1 to R3, q and w are defined as recited in the specification, and the amount of monomer (b) is about 1 part by weight to about 800 parts by weight per 100 parts by weight of monomer (a). The polymer is useful as an electrolytic material of a solid capacitor.

Abstract: A passivation composition and use of the composition in a method of forming a conductive pattern are provided. The passivation composition includes an oxidizing agent, an inorganic base with a general formula M(OH)n and a solvent, wherein M is a metal ion and n is the valence number of the metal ion. The method includes the following steps: (a) forming a polymer conductive layer on a substrate, wherein the polymer conductive layer is consisting of a first area and a second area. The first area is corresponding to a conductive area to be formed; and (b) passivating the second area by using the passivation composition to reduce the conductivity of the second area and form the conductive pattern on the substrate.

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The present invention provides a biomedical device comprising a porous hydrophilic substrate; a hydrophobic material; a fluid inlet; two or more test zones, wherein fluid vertically flows through the porous hydrophilic substrate and then distributes into the test zones. The present invention further provides a method for making a biomedical device.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: The invention pertains to a conductive material formulation comprising: (a) a conductive polymer material; and (b) an insulation material, wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; and wherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.

Abstract: An aluminum paste composition is provided, which comprises: (a) an aluminum powder, (b) a glass grit, (c) a binder, and (d) a dispersing agent. A solar cell element is further provided, which includes an electrode or wire formed by coating the aluminum paste composition on a silicon semiconductor substrate and drying and sintering it. The dispersing agent contained in the aluminum paste composition of the present invention has good moisture resistance and is capable of effectively addressing the warping problem of a solar cell and improving the adhesion between the backside aluminum paste and the silver paste of the solar cell.

Abstract: The present invention provides a polymer having the structure of formula (I) wherein n, R1, R2, R3, R4, R5, R6, a, b and c are as defined in the specification. The present invention also provides a negative-acting photoimageable composition comprising the above-mentioned polymer of formula (I), which is suitable for the fabrication of printed circuit boards.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

Abstract: A composite optical film is provided. The composite optical film sequentially includes a substrate, a light diffusion layer, and a light-gathering layer. The light diffusion layer includes a binder and plural micro beads dispersed therein. The thickness of the light diffusion layer is 2-6 times of the average diameter of the micro beads, and the distance between adjacent micro beads is smaller than the average diameter of the micro beads. The light-gathering layer has plural light-gathering micro structures.

Abstract: A curable organopolysiloxane composition comprises the following: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups and having an average unit formula (I): (R12SiO2/2)a(R23SiO1/2)b(R3SiO3/2)c(SiO4/2)d(CH2CH2)e; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1 to R7 and a to j are as defined in the specification.

Abstract: The present invention provides a precursor composition for polyimides, said composition comprising an amic acid oligomer of formula (1) and a dianhydride derivative with ester (—C(O)OR) and carboxy (—C(O)OH) terminal groups of formula (2): wherein R, G, G1, P, D and m are as defined in the specification. The invention also provides polyimides synthesized from the above-mentioned precursor composition.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.

Abstract: Provided are a composition for anti-scratch and wear-resistance properties, a method of preparing the same, and its application. The composition has inorganic particles, a dispersant and an organic binding agent. The inorganic particles are spherical and have an average particle size ranging from 10 nanometers to 999 nanometers. The dispersant has an inorganic dispersant and a polymer dispersant. The specific gravity of the inorganic particles and inorganic dispersant are respectively represented by s1 and s2, 0.05<s2/s1<1. The total amount of inorganic particles and inorganic dispersant ranges from 0.5 to 70 parts by weight, the amount of polymer dispersant ranges from 0.1 to 20 parts by weight, and the amount of organic binding agent ranges from 10 to 98 parts by weight. Since the inorganic particles are stably dispersed in the composition, the composition can be applied to coating, paint or composite materials and has improved wear-resistant and anti-scratch properties.

Abstract: A thiophene derivative, which has a chemical structure of formula (1): wherein, X is a substituted or non-substituted C6-C20 aromatic or C1-C20 aliphatic group; R1 and R2 are independently H, a C1-C10 linear, branched, or cyclic aliphatic group, or connected with the carbon atoms of formula (1) to form a first heterocyclic ring; R3 and R4 are independently H, a C1-C10 linear, branched, or cyclic aliphatic group, or connected with the carbon atoms of formula (1) to form a second heterocyclic ring; and b is an integer ranging from 1 to 10, with a proviso that X is not when all of R1, R2, R3 and R4 are H.