Patents Assigned to etifix GmbH
  • Publication number: 20260148031
    Abstract: A microwave-safe inlay includes an RFID chip, an antenna, and a substrate having special shielding surfaces. These shielding surfaces are arranged in such a manner that they block microwave radiation, while communication in the HF/NFC and UHF range continues to be possible. The inlay is thin, mechanically and thermally durable, and can be used with or without shielding elements to be additionally placed under it. It is particularly intended for use with and integration into reusable microwavable dishes, so as to allow reliable identification and writing and/or reading of additional information, as well.
    Type: Application
    Filed: November 20, 2025
    Publication date: May 28, 2026
    Applicant: etifix GmbH
    Inventor: Martin BOHN
  • Patent number: 12393815
    Abstract: For improved durability during use in a microwave oven, and at the same time, good readability of a smart label, it is provided that a flat RFID inlay made up of an RFID chip and an antenna is applied to a metal shield that is made up of at least two mutually overlapping foil sections. A recess in the foil sections is enclosed by the antenna of the RFID inlay. When such a smart label with the metal shield is applied in advance to a microwave dish, and a shielding element that is impermeable to microwave radiation in the microwave oven is temporarily overlaid on the smart label from the opposite side, such a smart label can be used in the microwave oven without damage, but remains readable outside the microwave oven, and without the shielding element.
    Type: Grant
    Filed: September 10, 2024
    Date of Patent: August 19, 2025
    Assignee: etifix GmbH
    Inventor: Martin Bohn