Abstract: The application relates to modular electronic apparatus (1) for distribution of RF communication signals. The apparatus comprises a chassis (2) arranged to removably receive plural modules (3), at least some of which are arranged to receive and process RF communication signals. A communication path (17) is provided for modules to communicate with each other and/or with the chassis. Plural modules received in the chassis. When a module is received in the chassis, it is arranged to broadcast a message over the communication path indicating its presence in the chassis and its type. At least one other module is arranged to adapt its behaviour in response to the message.
Type:
Grant
Filed:
September 21, 2023
Date of Patent:
March 5, 2024
Assignee:
ETL Systems Limited
Inventors:
Esen Bayar, Sebastien Francis Butstraen, Simon Richard Swift
Abstract: The present application describes a connector assembly, a circuit board assembly, a cable assembly and to a method of manufacturing a connector assembly. A connector assembly comprises a shroud; and a plurality of co-axial radio frequency connectors at least partially received in the shroud such that the shroud extends around each radio frequency connector and between adjacent radio frequency connectors. The shroud comprises at least one piece of radiowave absorption material arranged to absorb radio frequency energy leaking or dispersing from the radio frequency connectors in use. Another connector assembly comprises a body, a plurality of radio frequency connectors at least partially received in the body, and a conductive foil integrally formed with the body and partially extending beyond the body.