Patents Assigned to EUDYNA DEVICES
  • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    Publication number: 20080087634
    Abstract: A manufacturing method of a semiconductor device includes forming a metal mask on a substrate or on a layer provided on the substrate, and removing at least one of the substrate and the layer provided on the substrate selectively through a dry etching treatment with use of the metal mask. The metal mask has a first open pattern and a second open pattern. The first open pattern is opened at a given area of the metal pattern. The second open pattern is opened at an area dividing the metal mask.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 17, 2008
    Applicant: EUDYNA DEVICES
    Inventors: Toshiyuki Kohsaka, Tsutomu Komatani