Abstract: A method of fabricating a silicon power semiconductor with a stop zone includes forming a stop zone by driving oxygen into a semiconductor substrate in a targeted manner and subsequently heating the oxygen with the semiconductor substrate to form thermal donors, and producing, at or near a surface of the semiconductor substrate, an increased oxygen concentration in comparison with other semiconductor regions by ion implantation.
Type:
Grant
Filed:
July 2, 2001
Date of Patent:
December 9, 2003
Assignee:
EUPEC Europaeische Gesellschaft fuer Leitungshalbleiter mbH
& Co. KG