Patents Assigned to EUPEC GmbH
  • Semiconductor module and method for fabricating the semiconductor module
    Patent number: 6853088
    Abstract: A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: February 8, 2005
    Assignee: EUPEC GmbH
    Inventors: Gottfried Ferber, Reimund Pelmer