Abstract: A socket for testing integrated circuit has opposite cantilever probing pads hinged at the far ends of the cantilevers to a circuit board. The leads of the IC are pressed over the free nearer ends of the cantilevers. Cushions are inserted under the two free nearer ends of the cantilevers to absorb in the pressure of the IC leads. For in-line lead IC packages, a common cushion can be used for each line of leads. Metallic pedestals can be mounted on the between the nearer ends of the cantilever and touching the IC under test for heat sinking and common ground. The pedestals can be inserted through the circuit board from a base plate at the bottom of the circuit board.