Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

Abstract: The present invention relates to a device for embossing structures into an embossing material, having a structure punch for embossing the structures into the embossing material. The structure punch can be kept under a constant local expansion during embossing and separation from the embossing material.

Abstract: A method for the surface treatment of a substrate surface of a substrate includes arranging the substrate surface in a process chamber, bombarding the substrate surface with an ion beam, generated by an ion beam source and aimed at the substrate surface, to remove impurities from the substrate surface, whereby the ion beam has a first component, and introducing a second component into the process chamber to bind the removed impurities. A device for the surface treatment of a substrate surface of a substrate includes a process chamber for receiving the substrate, an ion beam source for generating an ion beam that has a first component and is aimed at the substrate surface to remove impurities from the substrate surface, and means to introduce a second component into the process chamber to bind the removed impurities.

Abstract: A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates. The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber; contacting the contact surfaces at a bond initiation surface; and bonding the first substrate to the second substrate from the bond initiation surface to the centre of the substrates.

Abstract: The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.

Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.

Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Abstract: A method and a device for the separation of structures from a substrate. Furthermore, the invention relates to a method and a device for transferring structures from a first substrate to a second substrate.

Abstract: The present invention relates to a substrate holder, a bonding device, a method for producing a substrate holder and a method for bonding.

Abstract: The invention relates to a carrier substrate for transferring a transfer layer from the carrier substrate onto a product substrate and a method for the production of a carrier substrate and a method for transferring a transfer layer from a carrier substrate onto a product substrate.

Abstract: A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: The invention relates to method for applying a protective coating material to a structural layer to form a protective coating.

Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.

Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.

Abstract: The invention relates to a method and a device for the exposure of a photosensitive coating.

Abstract: A method producing micro- and/or nanostructures includes fixing a substrate with an embossing material on a substrate accommodating device, contacting of a structured stamp with the embossing material, curing of the embossing material, and removal of the embossing material from the structured stamp.

Abstract: The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.