Abstract: The present invention relates to a substrate holder, a bonding device, a method for producing a substrate holder and a method for bonding. The substrate holder includes a substrate holder surface, a central elevation, and one or more support elevations. The central elevation is arranged on the substrate holder surface with a first mounting surface. The support elevations are respectively arranged on the substrate holder surface with second mounting surfaces. A substrate is arranged on the first mounting surface of the central elevation and on the second mounting surfaces of the one or more support elevations. The first mounting surface is larger than the second mounting surfaces.

Abstract: A method and a device for the separation of structures from a substrate. Furthermore, the invention relates to a method and a device for transferring structures from a first substrate to a second substrate.

Abstract: The invention relates to a method for detaching a stamp from a substrate, in particular from a master stamp and/or from a product. The stamp is deformed in a direction of the substrate in order to detach the stamp from the susbtrate.

Abstract: A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.

Abstract: The invention relates to method for applying a protective coating material to a structural layer to form a protective coating.

Abstract: The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.

Abstract: A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e1) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e2) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: A device and a method for the alignment of substrates. The device includes a first substrate holder for receiving a first substrate that has at least two alignment marks, a second substrate holder for receiving a second substrate that has at least two alignment marks, at least one alignment optic for detecting the alignment marks of the first and second substrates, and at least one positioning optic for detecting positioning marks, wherein the alignment marks of the first substrate and the alignment marks of the second substrate can be aligned with one another depending on the positioning marks. The method of alignment includes the steps of fixing the first and second substrates on respective first and second substrate holders, detecting alignment marks on the substrates, detecting positioning marks, and aligning the alignment marks of the substrates with one another in dependence on the positioning marks.

Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

Abstract: The invention relates to a method and a device for the exposure of a photosensitive coating.

Abstract: Apparatus and method for heating a substrate. The apparatus including a heater and a substrate holder with a substrate holder surface, wherein the substrate to be heated can be placed on the substrate holder surface, the apparatus further includes means for exerting forces on the heater, the apparatus further includes a control unit for controlling the means, wherein the heater is deformable by the means.

Abstract: The present invention relates to a method for providing a multi-layer system, a multi-layer system and a method for bonding and debonding.

Abstract: A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e1) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e2) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.

Abstract: A method for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

Abstract: A method for producing micro- and/or nanostructures includes fixing a substrate with an embossing material on a substrate accommodating device, contacting of a structured stamp with the embossing material, curing of the embossing material, and removal of the embossing material from the structured stamp.

Abstract: The invention relates to a method and a substrate system for the separation of a carrier substrate from a substrate, in particular a product substrate, by irradiation of the separating layer.

Abstract: A method for producing micro- and/or nanostructures includes fixing a substrate with an embossing material on a substrate accommodating device, contacting of a structured stamp with the embossing material, curing of the embossing material, and removal of the embossing material from the structured stamp.

Abstract: A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.