Abstract: The present invention relates to an accommodating device for accommodation and mounting of a wafer for application of a fluid to a top of the wafer with the following features: a revolving ring section with: d) a revolving upper edge, e) a revolving recess and f) a circumferential wall running from the upper edge to the recess, a contact plane (A) arranged within the ring section for the accommodation of the wafer on a contact surface of the wafer, wherein the ring section by means of accommodation of the wafer forms with said wafer an accommodating space for accommodation of the fluid.
Type:
Application
Filed:
November 21, 2012
Publication date:
September 24, 2015
Applicant:
EV GROUP INC.
Inventors:
Spencer Hochstetler, Richard Dalton Peters, Travis Acra