Abstract: A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess.

Abstract: Various embodiments of a digit display are provided. In one aspect, a digit display comprises at least one display unit. The at least one digit unit comprises twenty-eight character segments that are arranged in a manner including a quadrilateral, a cross, and four X-shaped arrangements. The quadrilateral is formed by eight of the twenty-eight character segments with two character segments on each of four sides of the quadrilateral. The cross is formed by four of the twenty-eight character segments and dividing the quadrilateral into four quadrants. Each of the four X-shaped arrangements is disposed in a respective one of the four quadrants and formed by respective four of the twenty-eight character segments.

Abstract: In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.

Abstract: An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.

Abstract: The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.

Abstract: Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.

Abstract: Embodiments of a light emitting diode (LED) package structure are provided. In one aspect, an LED package structure includes a base, at least one LED chip, a blocking plate, and a transparent cover plate. The LED chip is disposed on and electrically coupled to the base. The blocking plate is disposed on the base and surrounds the LED chip. The blocking plate has an opening for exposing the LED chip. The blocking plate comprises a light-absorbing material that is opaque. The transparent cover plate is disposed on the blocking plate and covers the opening of the blocking plate.

Abstract: A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units.

Abstract: An illumination module including a substrate and a plurality of first and second LED chips is provided. The substrate has a plurality of device bonding areas, and each of device bonding areas has two sub-device bonding areas. Each sub-device bonding area has a first, second, and common route. The first routes surround the outer peripheries of each device bonding area. The second routes are located between the two sub-device bonding areas. The common routes are located between the first and second routes. The first LED chips located at the common routes are electrically connected to each other. The second LED chips located at the first and second routes respectly are electrically connected to each other.

Abstract: An LED package structure comprises an LED chip and a fuse electrically connected to the LED chip in series. The fuse has a low melting point such that the fuse melts under a high current to form an open circuit to prevent the high current from flowing through the LED chip.

Abstract: A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.

Abstract: A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip.

Abstract: A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.

Abstract: The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.

Abstract: Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.

Abstract: A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound.

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract: Embodiments of the present disclosure relate to a novel semiconductor. In one aspect, the semiconductor may include a transparent layer having a first surface, a first doped layer, a second doped layer, and an active layer. The first doped layer may be formed over the first surface of the transparent layer and have a plurality of first-type electrodes formed thereon. The second doped layer may be formed over the first surface of the transparent layer and have a plurality of second-type electrodes formed thereon. The active layer may be formed between the first doped layer and the second doped layer. A distance between at least one of the first-type electrodes and a nearest other one of the first-type electrodes may be greater than each of respective distances between the at least one of the first-type electrodes and more than two of the second-type electrodes.

Abstract: A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.

Abstract: An improved LED lamp manufacturing method and an improved LEP lamp device are described. In one aspect, an LEP lamp device includes an LED lamp bulb, a pair of electrical cables electrically coupled to the LED lamp bulb, and a main body. The main body encloses part of the LED lamp bulb, part of the pair of cables, a connection between the LED lamp bulb, and the pair of electrical cables. The main body includes a first plastic member and a second plastic member coupled to the first plastic member. Each of the first plastic member and second plastic member has a respective pair of cable grooves. The first plastic member or the second plastic member, or both, have one or more welding lines along an edge and between the respective pair of cable grooves.