Patents Assigned to Everstone Industry Corp.
  • Patent number: 6812555
    Abstract: A memory card substrate includes a first solder pad assembly formed on a top edge of the memory card substrate. The first solder pad assembly has multiple first solder pads equally spaced from each other and multiple first gaps each sandwiched between two adjacent first solder pads. A second solder pad assembly is formed on a bottom edge of the memory card substrate and has multiple second solder pads equally spaced from each other and multiple second gaps each sandwiched between two adjacent second solder pads. Each first solder pad corresponds to one of the second gaps so that the first solder pads are alternately arranged on the top edge relative to the second solder pads on the bottom edge.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: November 2, 2004
    Assignee: Everstone Industry Corp.
    Inventor: Chien-Hung Chen
  • Publication number: 20040178513
    Abstract: A memory card substrate includes a first solder pad assembly formed on a top edge of the memory card substrate. The first solder pad assembly has multiple first solder pads equally spaced from each other and multiple first gaps each sandwiched between two adjacent first solder pads. A second solder pad assembly is formed on a bottom edge of the memory card substrate and has multiple second solder pads equally spaced from each other and multiple second gaps each sandwiched between two adjacent second solder pads. Each first solder pad corresponds to one of the second gaps so that the first solder pads are alternately arranged on the top edge relative to the second solder pads on the bottom edge.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 16, 2004
    Applicant: Everstone Industry Corp.
    Inventor: Chien-Hung Chen
  • Patent number: D482694
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: November 25, 2003
    Assignee: Everstone Industry Corp.
    Inventor: Chien-Hung Chen