Patents Assigned to Evertechno Co., Ltd.
  • Patent number: 8263873
    Abstract: Provided is a flexible printed circuit board (FPCB) for a large capacity signal transmission medium that may maintain an impedance suitable for accurately transmitting a large capacity signal such as a low-voltage differential signaling (LVDS) signal and may also have an excellent flexibility. A copper foil large capacity signal wire includes a plurality of first pads and a plurality of second pads that are spaced apart from each other at predetermined intervals and are alternately provided, to receive a large capacity signal from a television main board and to transmit the received large capacity signal to a display device. The first pad has a positive phase and the second pad has a negative phase. A copper foil ground layer is attached at a distance from the cooper foil large capacity signal layer to ground the large capacity signal that is transmitted to and is returned from the display device.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: September 11, 2012
    Assignees: Evertechno Co., Ltd.
    Inventors: Gyoung Duck Choi, Byeong Sik Son