Patents Assigned to EXA CO., LTD.
  • Publication number: 20120006726
    Abstract: A wafer separation apparatus improves wafer separation performance in separation and transfer and suppresses the occurrence of wafer breakage in separation and transfer, while remaining inexpensive and small. The apparatus includes: a cassette that vertically accommodates a large number of single wafers in intimate contact with each other, the cassette being at least vertically opened; a cassette support that removably supports the cassette, the cassette support being at least vertically opened; a hoisting unit that hoists and lowers the cassette support integrally with the cassette; a liquid bath that accommodates a liquid into which the cassette support is immersed integrally with the cassette when the hoisting unit descends; a nozzle in the inside of the liquid bath to issue micro bubbles from the underside of the cassette support toward a large number of the wafers; and a micro bubble generator that generates micro bubbles to be issued from the nozzle.
    Type: Application
    Filed: January 12, 2010
    Publication date: January 12, 2012
    Applicants: KABUSHIKI KAISHA WATANABAE SHOKO, EXA CO., LTD.
    Inventors: Ichiki Kusuhara, Kyouhei Tsunashima