Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling system 100 includes a cooling tank 11 filled with a coolant C, flow passages 15, 16 through which the coolant discharged from an outlet of the cooling tank 11 returns to an inlet of the cooling tank 11, an inverted U-like piping unit 16a disposed in the middle of the flow passage 16, a main pump 31, an auxiliary pump 33 disposed opposite the main pump 31 while interposing the inverted U-like piping unit 16a with the main pump 31, and a controller 35 which controls driving operations of the main pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a predetermined time period before starting the main pump 31.

Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom.

Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and flash storage units mounted on the respective storage substrates. The backplane includes a combination of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.

Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors.

Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups that includes a first circuit board having at least one processor and main memories mounted onto one surface of the board, coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories.

Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.

Abstract: A cooling system is configured to directly cool electronic devices of different types immersed in a coolant filled in a cooling apparatus having a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using internal partition walls in the cooling tank, an inflow opening formed in a bottom part or a side surface of each of the housing parts, and an outflow opening formed around a surface of the coolant circulating in the respective housing parts. Electronic devices of different types include first electronic devices configured to execute arithmetic operations through processors, and second electronic devices configured to execute storage through storage units. The arbitrary numbers of the first and second electronic devices are separately housed in the housing parts of the cooling apparatus to form a computer with a calculation capacity and a storage capacity.

Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors.

Abstract: An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.

Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.

Abstract: A cooling system is configured to directly cool electronic devices of different types immersed in a coolant filled in a cooling apparatus having a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using internal partition walls in the cooling tank, an inflow opening formed in a bottom part or a side surface of each of the housing parts, and an outflow opening formed around a surface of the coolant circulating in the respective housing parts. Electronic devices of different types include first electronic devices configured to execute arithmetic operations through processors, and second electronic devices configured to execute storage through storage units. The arbitrary numbers of the first and second electronic devices are separately housed in the housing parts of the cooling apparatus to form a computer with a calculation capacity and a storage capacity.

Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.

Abstract: In a cooling system for electronic apparatuses, the electronic apparatus includes inner partitioning walls disposed in a cooling tank with an open space, defined by a bottom wall and side walls for dividing the open space into arrayed storage sections. An electronic apparatus is stored in the storage section. Inflow openings for the cooling liquid are formed in a bottom portion or a side surface of the respective storage sections, and outflow openings are formed at a position near the liquid surface of the cooling liquid flowing in the respective storage sections. The electronic apparatus includes a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface, a second board having the third surface that faces the second surface of the first board, and a flow channel formed as a gap between the second and third surface.

Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.

Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).

Abstract: In a cooling system for electronic apparatuses, the electronic apparatus includes inner partitioning walls disposed in a cooling tank with an open space, defined by a bottom wall and side walls for dividing the open space into arrayed storage sections. An electronic apparatus is stored in the storage section. Inflow openings for the cooling liquid are formed in a bottom portion or a side surface of the respective storage sections, and outflow openings are formed at a position near the liquid surface of the cooling liquid flowing in the respective storage sections. The electronic apparatus includes a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface, a second board having the third surface that faces the second surface of the first board, and a flow channel formed as a gap between the second and third surface.

Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.