Abstract: A system for analyzing electronic devices is described. An input station receives a plurality of electronic devices. A pick-and-place transport apparatus having a pick up tip for engaging and transporting one of the electronic devices at a time from the input station to the electric machine interface station, disengaging from the electronic device, and moving away from the electronic device The pick up tip is movable for engaging the electronic device while at the electric machine interface station and transporting the electronic device away from the electric machine interface station to disengage the electronic devices from the electric machine interface. First and second thermal devices secured to the support structure on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or form the electronic device.

Abstract: A system for analyzing electronic devices is described. An input station receives a plurality of electronic devices. A pick-and-place transport apparatus having a pick up tip for engaging and transporting one of the electronic devices at a time from the input station to the electric machine interface station, disengaging from the electronic device, and moving away from the electronic device The pick up tip is movable for engaging the electronic device while at the electric machine interface station and transporting the electronic device away from the electric machine interface station to disengage the electronic devices from the electric machine interface. First and second thermal devices secured to the support structure on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or form the electronic device.

Abstract: A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device.

Abstract: A system for analyzing electronic devices includes a first cab, an input station, a transport apparatus, an electric machine interface station, and an electric machine interface. The first cab includes a holder having formations for removably receiving a first subset of electronic devices and a communications interface. The input station receives the first cab and the transport apparatus transports the first cab with the first subset of electronic devices from the input station to the electric machine interface station. The electric machine interface is positioned to engage communicatively with the communications interface of the first cab when the first cab is at the electric machine interface station, and is disengageable from the communications interface of the first cab for the first cab to be transportable by the transport apparatus away from the electric machine interface station. Heat conducts to or from the electronic devices while they are being analyzed.

Abstract: The invention provides an interconnecting assembly including a main structure having first and second portions, an inner terminal on the main structure, a support film having first and second portions, an inner contact and outer terminal formed on opposing sides of the support film, a conductive lever portion on the support film and connecting the inner contact and outer terminal, wherein the inner contact contacts the inner terminal and the first portions are moved relatively towards one another so that the second portion of the film is pivoted together with the conductive lever portion and the outer terminal away from the second portion of the main structure, the outer terminal being depressible towards the main structure from a first position to a second position and returning to the first position when a force depressing the outer terminal is removed.

Abstract: According to one aspect of the present invention, a method of constructing an interposer is provided. A conductive layer is formed on a nonconductive layer. The conductive layer has via portions, non-via portions, and first and second opposing surfaces. The first surface of the conductive layer is adjacent to the nonconductive layer. Portions of the nonconductive layer are removed to expose portions of the first surface of the conductive layer. Conductive pads are formed on the exposed portions of the first surface and the second surface of the conductive layer. The non-via portions of the conductive layer are removed to form a plurality of electrically separated conductors. Each conductor includes at least two conductive pads and a via portion of the conductive layer.

Abstract: A method of marking an article is described. A laser beam is generated. A position of a focal point of the laser beam is detected with a CCD detector that is in a predetermined position relative to a frame. The detector is then moved out of a plane of the focal point. An article is then held by a holder that is in a predetermined position relative to the frame, so that a marking surface of the article is in the plane. The laser beam is then directed onto the marking surface of the article, and the focal point is moved relatively across the marking surface. The position of the focal point on the marking surface is based on both the data set and reference position. The reference position may, for example, be deducted from factory calibration data to obtain modified calibration data, and the modified calibration data may be used to control the laser beam.

Abstract: An apparatus for assembling electronics is provided, comprising a support frame, at least one pick-and-place mechanism, at least one device-engaging component, a feed device, and a programmer or tester. The pick-and-place mechanism is secured to the support frame. The device-engaging component is secured to the pick-and-place mechanism. The feed device has a slender body secured to the frame to feed a plurality of electronic devices to a feed location. The programmer or tester has a slender body secured to the support frame in a side-by-side relationship relative to the feed device. The programmer or tester has a socket located at an intermediate location. The devices are movable by the device-engaging component from the feed location to the socket at the intermediate location.

Abstract: The invention relates to a test socket interposer. The interposer includes a flexible substrate with an upper signal contact and an upper ground contact on its top surface and a lower signal and a lower ground contact on its bottom surface. A portion of an upper surface of the upper signal contact is higher and to the right of an upper surface of the ground contact so that a signal contact of a device contacts the upper signal contact before a device ground slug contacts the upper ground contact. Also, a downward force exercised by the device signal contact causes pivoting of the upper signal contact and the substrate is sufficiently flexible to allow for this pivoting of the upper signal contact.

Abstract: Data to be programmed into memory-containing ICs is divided into a number (X) of blocks preferably equal to the number of sockets on a common programmer unit. A pick-up head inserts an unprogrammed IC into the first socket and the IC is programmed with a first data block A. While programming is occurring the pick-up head fetches an unprogrammed IC and inserts it into a second socket, whereupon both ICs are simultaneously programmed with the second data block B. During this time an unprogrammed IC is fetched and inserted into a third socket, whereupon all socketed ICs are simultaneously programmed with a third data block C. Eventually the first IC is fully programmed and is replaced with an unprogrammed IC and the cycle continues until all ICs to be programmed have been programmed. Multiple pick-up heads and/or multi-socketed programming units can be used.

Abstract: A high density electrical connector assembly comprising first and second sheet-like bodies. The first sheet-like body is made from an insulating material and has a surface and a plurality of electrical traces extending to a plurality of first interconnect pads disposed on the surface in a first pattern. The second sheet-like body is also made from an insulating material and has a surface and a plurality of second electrical traces extending to a plurality of second interconnect pads disposed on the surface of the second sheet-like body in a second pattern. The second pattern is substantially a mirror image of the first pattern. The surface of the first sheetlike body faces the surface of the second sheet-like body so that the first interconnect pads face the second interconnect pads. A flexible sheet of an insulating and compliant material is disposed between the first and second interconnect pads and has first and second opposite surfaces.