Abstract: A near field communication antenna device of a mobile terminal is provided. The near field communication antenna device includes a window including a display region for transmitting an image displayed by a display and a black mark region formed around the display region, a multi-layer Flexible Printed Circuit Board (FPCB) on which a plurality of layers are laminated on the lower side of the black mark region of the window, and a spiral loop-shaped antenna pattern in which conductive lines are formed on respective layers of the multi-layer FPCB and are connected to each other. Accordingly, a near field communication antenna is not disposed in a separated installation space, an antenna pattern width can be reduced, and performance of the near field communication antenna may be prevented from being degraded when a battery cover is made of metal or has a curved shape.

Abstract: The present invention relates to a UHF RFID tag, and provides a set of UHF RFID tag comprising a loop-patterned sheet on which a RFID chip is mounted so as to form a closed loop and a dipole-patterned sheet that is separate from the other. According to the present invention, loop-patterned sheets having simple form and small size can be mass-produced in a few simple types. A mounting process for a RFID chip on the loop-patterned sheets which require precise work can be simplified. In addition, a set of RFID tag according to the present invention can be applied in various environments by combining a few types of the loop-patterned sheet and various types of dipole-patterned sheets.

Abstract: The present invention provides a metal paste for forming an electrically conductive layer comprising a metal solution in a reactive organic solvent having a heteroatom P, S, O, or N; metal powder; a binder; and a residual amount of a polar or non-polar viscosity modulating solvent. The metal paste composition according to the present invention has advantages in that it produces structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles. The metal paste also provides a silver paste, which can be economically prepared and has high adaptability to various surfaces.

Abstract: The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent. The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.

Abstract: The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver aromatic carboxylate and a reactive organic solvents, which can form chelate or complex with silver, are, for example, organic solvents having keton, mercapto, carboxyl, aniline or sulfurous functional group, substituted or unsubstituted. By the present invention, silver organo-sol ink of solution type basically having higher content of silver is obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming drastically.

Abstract: A method of preparing printed circuit boards (PCB) or flexible printed circuit boards (FPCB) by direct printing includes: 1) a step of printing a pattern on substrate with a paste composition including conductive particles, polyamic acid as binder and solvent; 2) a step of baking the printed substrate to imidize the polyamic acid; and 3) a step of electro-plating the printed substrate. Printed circuit boards (PCB) or flexible printed circuit boards (FPCB) are produced by applying an addition method of direct printing while to simplify processes, to save time and cost, and to minimize waste.

Abstract: A paste composition for forming heat-resistant and electrically conductive patterns on substrate by direct printing includes conductive particles, polyamic acid, and solvent. The paste composition can form solderable electric circuits or solderable antenna on substrate, especially on flexible sheets by direct printing to simplify processes, to save time and cost, and to minimize waste.

Abstract: The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver CO to C16 aliphatic carboxylate saturated or unsaturated, linear or branched, unsubstituted or substituted with amino, nitro and/or hydroxy group(s) having 1 to 3 carboxyl groups or silver aromatic carboxylate; and organic solvent. By the present invention, silver organo-sol inks of solution type basically having higher content of silver for various reducing or metallizing temperatures are obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming.