Abstract: An illumination system for an endoscope has a plurality of light assemblies, including a red assembly with a red light source, a blue assembly with a blue light source, a green assembly with a green light source, and an infrared (IR) assembly with an IR light source. Each light assembly further includes an output beam shape adjuster configured to receive an output beam from the respective light source and adjust the beam angular profile, and an output beam angle adjuster configured to receive a beam from the output beam shape adjuster and adjust the output beam angle. A plurality of dichroic plates are configured to combine output beams of the red assembly, the blue assembly, the green assembly, and the IR assembly.

Abstract: A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Abstract: A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

Abstract: A method is disclosed for maintaining a desired optical output in a solid state illumination device, where the device is configured to accommodate multiple light emitting diodes (LEDs) and to combine light from the LEDs to produce a single optical output. The method includes testing the LEDs before adding them into the device. The testing produces characterizing information that describes how one or more optical properties (e.g., optical power and/or peak wavelength) of the tested LED change with temperature. This characterizing information is stored in a computer-based memory of the device, and the tested LED is added (connected) into the device. Then, during operation, temperature sensors measure a temperature associated with each respective LED in the device, and electrical current to one or more of the LEDs can be adjusted based on the measured temperatures associated with each LED and its stored characterizing information.

Abstract: A semiconductor package is manufactured by physically attaching a side emitting laser diode to a floor portion of a recessed flat no-leads (FNL) package having a wall extending from and surrounding a perimeter of a recessed floor portion. The attached side emitting laser diode is oriented to direct a laser beam toward an opposing portion of the wall. The FNL package is singulated into a first piece and a second piece along a singulation plane through the FNL package wall and floor portion between the side emitting laser diode and the opposing portion of the wall. After singulation the opposing portion of the wall is in the second piece and the side emitting laser diode is in the first piece.

Abstract: An illumination system includes a phosphor to emit light in a wavelength band ??PHOSPHOR, a second light source to emit light at a second wavelength ?2 within an absorption band of the phosphor, a third light source to emit light at a third wavelength ?3 and a fourth light source to emit light at a fourth wavelength ?4. A controller drives the second, third and fourth light sources. A first dichroic optical element: 1) directs light from the phosphor to an optical output of the system, 2) directs light from the third light source to the optical output, and 3) directs light from the fourth light source to the optical output. A second dichroic optical element: 1) directs light from the third light source to the first dichroic optical element, and 2) directs the light from the fourth light source to the first dichroic optical element.

Abstract: A dispensing and ultraviolet (UV) curing system is disclosed with low backscatter. The system includes a dispenser for dispensing an ultraviolet (UV) curable material onto a substrate and a UV radiation source assembly coupled to the dispenser and operable to facilitate curing the UV curable material that has been dispensed onto the substrate. The UV radiation source assembly has a UV radiation source with a first optical axis and an optical element with a second optical axis. The second optical axis is different than the first optical axis. The optical element is configured such that, during operation, UV radiation from the UV radiation source passes through the optical element.

Abstract: A UV curing system and method for providing an adjustable beam profile are disclosed for UV curing for ultra high speed industrial applications, such inkjet printing with improved print quality and efficiency. Also provided is a lamp head assembly for a UV source for such a system, which provides an adjustable beam profile for optimizing UV curing. The lamp head assembly comprises one or more light sources and reflectors or other optical elements, which may be relatively movable and adjustable, to adjust the beam profile to processing conditions and requirements for consistent curing efficiency and print quality at different print speeds. Specific features of such a lamp head assembly may permit adjustment of the spectral, spatial and temporal distribution of light for improved or optimized curing efficiency in ultra-fast UV curing applications.

Abstract: A high power microscopy illumination system is disclosed, having a liquid cooled, Solid State Light Source (SSLS) unit including one or more LED light sources, thermally mounted on a cold plate, which is cooled by a closed-loop liquid cooling system including a remote unit housing a heat exchanger. The SSLS unit with the LED light source is compact and lightweight, and is mechanically and optically directly coupled to the illumination port of the microscope, for efficient optical coupling to the imaging plane. High capacity cooling of the LEDs, enables the LEDs to be driven at higher current densities for increased optical output and for operation with improved thermal stability. The LED driver circuitry may also be housed within the SSLS unit and liquid cooled. The SSLS unit is vibrationally isolated from vibration-causing components of the cooling system, such as cooling fans and other bulky components, which are housed in the remote unit.

Abstract: An illumination system includes a phosphor to emit light in a wavelength band ??PHOSPHOR, a second light source to emit light at a second wavelength ?2 within an absorption band of the phosphor, a third light source to emit light at a third wavelength ?3 and a fourth light source to emit light at a fourth wavelength ?4. A controller drives the second, third and fourth light sources. A first dichroic optical element: 1) directs light from the phosphor to an optical output of the system, 2) directs light from the third light source to the optical output, and 3) directs light from the fourth light source to the optical output. A second dichroic optical element: 1) directs light from the third light source to the first dichroic optical element, and 2) directs the light from the fourth light source to the first dichroic optical element.

Abstract: A device for increasing the optical power of a solid state light source in the green and/or yellow bands, is disclosed. The device has an integral body having an ingress surface configured to receive light from an emitting portion of the solid state light source, an egress surface substantially opposite the ingress surface, and a recess formed within the body. The recess has an input opening in the ingress surface, an output opening in the egress surface, and a recess surface within the body extending between the input opening and the output opening. The recess surface is configured to reflect visible light with Lambertian scatter characteristics.

Abstract: A chip slapper is presented, having a substrate, a conductive layer disposed above the substrate face, and an intermediate layer disposed between the substrate face and the conductive layer. The conductive layer and intermediate layer form a first land and a second land atop the substrate face, with a bridge formed of the intermediate layer spanning between the first land and the second land. A first adhesion portion is attached to the first land, and a second adhesion portion is attached to the second land, wherein at least a portion of the bridge is not overlaid by the first adhesion portion or the second adhesion portion.

Abstract: Embodiments of a light source include a substrate having a first end and a second end opposite the first end. A plurality of solid state light emitting diodes (LEDs) form an array, with the plurality of LEDs mounted on the substrate in a row between the first end and the second end. The plurality of LEDs further have a first edge LED and a second edge LED having a first encapsulation lens height relative to the substrate. At least one interior LED having a second encapsulation lens height less than the first encapsulation lens height is disposed between the first edge LED and the second edge LED. The spacing between the plurality of LEDs is substantially uniform.

Abstract: A high power microscopy illumination system is disclosed, having a liquid cooled, Solid State Light Source (SSLS) unit including one or more LED light sources, thermally mounted on a cold plate, which is cooled by a closed-loop liquid cooling system including a remote unit housing a heat exchanger. The SSLS unit with the LED light source is compact and lightweight, and is mechanically and optically directly coupled to the illumination port of the microscope, for efficient optical coupling to the imaging plane. High capacity cooling of the LEDs, enables the LEDs to be driven at higher current densities for increased optical output and for operation with improved thermal stability. The LED driver circuitry may also be housed within the SSLS unit and liquid cooled. The SSLS unit is vibrationally isolated from vibration-causing components of the cooling system, such as cooling fans and other bulky components, which are housed in the remote unit.

Abstract: A high power microscopy illumination system is disclosed, including a solid state illumination source. A diffusing collection lens having a diffusing surface is configured to collect and diffuse light emission from the solid state illumination source. An emitting surface is disposed substantially opposite the diffusing surface. An optical coupling element couples the light emission from the diffusing collection lens emitting surface along an optical axis to an optical output. The diffusing collection lens provides improved uniformity of illumination with direct coupling, without significant power loss.

Abstract: A photoelectric receiver circuit for converting an optical signal to an electrical signal is presented. The receiver includes a photodetector connected between a transimpedance amplifier input and a high voltage supply providing a bias voltage to the photodetector. A high voltage supply variation sensing element is connected between the high voltage supply and a current controlled current source, where the current controlled source output is connected to the input of the transimpedance amplifier. A current limiter is connected between the high voltage supply and a high voltage source. The photocurrent passing through the current limiter lowers the high voltage supply and is detected by the sensing element. Current from the sensing element is processed at the input of the transimpedance amplifier to minimize the current into the transimpedance amplifier, limiting the saturation of the amplifier, thus improving recovery time when a high optical power pulse impinges the photodetector.

Abstract: A solid state illumination system is disclosed, wherein a light source module comprises a first light source, comprising an LED and a phosphor layer, the LED emitting a wavelength ?1 in an absorption band of the phosphor layer for generating longer wavelength broadband light emission from the phosphor, ??PHOSPHOR, and a second light source comprising a laser emitting a wavelength ?2 in the absorption band of the phosphor layer. While operating the LED, concurrent laser pumping of the phosphor layer increases the light emission of the phosphor, and provides high brightness emission, e.g. in green, yellow or amber spectral regions. Additional modules, which provide emission at other wavelengths, e.g. in the UV and near UV spectral bands, together with dichroic beam-splitters/combiners allow for an efficient, compact, high-brightness illumination system, suitable for fluorescence imaging and analysis.

Abstract: Semiconductor devices and methods for forming semiconductor devices are presented. A device formed of a semiconductor material is configured to mount upon a substrate layer surface having a substrate layer wire attach pad. The device includes a top planar surface with an electrically active region, and a bottom planar surface disposed substantially parallel to the top planar surface. A shelf region is disposed between the top planar surface and the bottom planar surface, and a device wire attach pad in electrical communication with the active region is located on the shelf region.

Abstract: A method of reducing variation in optical power levels across a group of light emitting diodes includes testing each respective one of the light emitting diodes to determine an optical power level produced by that light emitting diode when connected to an electrical power source. During testing, the electrical power source delivers a substantially identical amount of electrical current to each respective one of the light emitting diodes. The optical power levels from the test all fall within a first range of values. The method includes connecting an electrical resistance in parallel with at least some of the light emitting diodes to reduce an amount of optical power produced by those light emitting diodes. After the electrical resistances are connected, all of the optical power levels produced by the light emitting diodes fall within a second range that is narrower than the first range.