Abstract: The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.

Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.

Abstract: The invention provides an automotive lighting unit for detecting electrical characteristics of light emitter diode component. At least one light emitter diode light source is selectively disposed on any one of at least one circuit channel of at least one drive power loop. At least one circuit breaker comprises at least one circuit switch corresponding to the at least one drive power loop, and is disposed on the circuit channel with the at least one light emitter diode light source. The at least one circuit channel is controlled by the at least one circuit switch to turn in a state of isolating from a drive power. An ammeter connection line is connected with the two sides one of the at least one light emitter diode light source.

Abstract: The invention provides a light-emitting diode grain structure with multiple contact points, including a P-type electrode, a conductive base plate, a light-emitting semiconductor layer, a plurality of ohmic contact metal points, a mesh-structured connection conductive layer, a connection point conductive layer, and an N-type electrode pad electrically connected to the connection point conductive layer. The plurality of ohmic contact metal points is arranged on an N-type semiconductor layer in a spreading manner, and is contacted with the N-type semiconductor layer. No ohmic contact is formed between the connection conductive layer and the N-type semiconductor layer. Accordingly, the metal points and the connection conductive layer can disperse a current, reduce a shading area, and improve the luminous efficiency and component reliability; and uniform light emission from a surface facilitates the light distribution uniformity of an original light source and exciting light after phosphor is coated.

Abstract: A vertical light emitting diode structure with high current dispersion and high reliability comprises a conductive substrate with a central region and a side region; a light emitting semiconductor layer is disposed on the central region; an ohmic contact metal layer is disposed at a center of the light emitting semiconductor layer; an N-type electrode is disposed at the side region and is connected with the ohmic contact metal layer and the N-type electrode through an N-type electrode bridging structure; a working current is diffused from the center of the light emitting semiconductor layer to have high current dispersion, so that the problem of heat dissipation of local high current caused by the design that the N-type electrode is disposed on the edge can be solved.

Abstract: A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrodes electrically connected to the first electrodes on the package surface layer, cutting the light-emitting diode chips, sorting and testing as well as regrouping the light-emitting diode chips, covering sides of the light-emitting diode chips with a package layer, drilling and filling a conductive material on the package layer to form a plurality of common electrodes, and then printing a plurality of common electrical circuits, electrically connecting each of the common electrical circuits to one of the common electrodes and the leading electrodes, and finally covering with a circuit protection layer to complete the process.

Abstract: A present invention includes at least two light cups and a composite material base. The composite material base comprises a first surface, a second surface and a third surface adjacent to the first surface, and a fourth surface opposite to the first surface. The at least two light cups are formed on the first surface. At least two first metal plates and at least two second metal plates having different polarities and corresponding to the quantity of the light cups are provided on the second surface. One ends of the at least two first and second metal plates individually pass through the composite material base and extend into the light cup to form two electrode contacts, and the other ends of the at least two first metal plates extend to the fourth surface to form an exposed heat dissipation structure.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A dual color temperature-controlling system, electrically connected to a brightness controlling module of a street light, includes a power supply controlling module, a switching module, a first and a second color temperature light emitting modules, and a comparing module. The switching module is electrically connected to the power supply controlling module. The first and the second color temperature light emitting modules are electrically connected to the switching module. The comparing module is electrically connected to the switching module. A voltage-type operating signal sent from the brightness controlling module is received by the comparing module for comparison, and a switching signal is then sent to the switching module. The switching module is switched for lighting up the first or second color temperature light emitting module depending on the switching signal. Thereby, color temperature of the street light is changed so as to enhance safety of road occupant.

Abstract: An LED illumination system includes a DC power supply, at least two LED illumination lamp sets and at least two power circuits corresponding to the LED illumination lamp sets. The DC power supply provides sufficient electric power for the LED illumination lamp sets and is connected to the LED illumination lamp sets via the power circuits. The invention supplies electric power required by the LED illumination lamp sets via a single DC power supply without an extra DC power supply, hence the cost is lower. Moreover, the DC power supply is located remote from the LED illumination lamp sets, hence high temperature generated by the DC power supply does not affect lighting and lifespan of the LED illumination lamp sets. The hazard of electric shock by inadvertently touching the AC power source while replacing lamps in the LED illumination lamp sets can also be avoided to improve safety.

Abstract: A LED flash bulb decorating light with features of able to achieve complicated light variation by employing simple circuit design, which comprises a power cord with a power plug, a series of single color, dual color or multiple color LED flash bulb forming in series or parallel circuit with the power cord. And a circuit control box comprises a low pass filter circuit and a power reset circuit and installed between the power plug of the power cord and the LED flash bulb, wherein the LED flash bulb at least comprises a LED chip and an IC driving element for driving the LED chip with DC power according to the setting time sequence to generate desired light variation. And the power reset circuit reset power supply at the repeated setting time interval to enable each LED flash bulb on the power cord to restart flash sequence to maintain the desired synchronous light variation.

Abstract: A LED flash bulb decorating light with features of able to achieve complicated light variation by employing simple circuit design, which comprises a power cord with a power plug, a series of single color, dual color or multiple color LED flash bulb forming in series or parallel circuit with the power cord. And a circuit control box comprises a low pass filter circuit and a power reset circuit and installed between the power plug of the power cord and the LED flash bulb, wherein the LED flash bulb at least comprises a LED chip and an IC driving element for driving the LED chip with DC power according to the setting time sequence to generate desired light variation. And the power reset circuit reset power supply at the repeated setting time interval to enable each LED flash bulb on the power cord to restart flash sequence to maintain the desired synchronous light variation.

Abstract: An improved LED lighting string employs a rectified and filtered device functioned as a low pass filter device to rectify input AC source into DC source providing to the LED lighting string for improving LED's flickering issue and to upgrade the optical power factor and efficiency, and luminous intensity in LED lighting string.

Abstract: A LED melody decoration kit with multicolor light sources comprises an electrical wire with a plug-connector to get a voltage from a traditional lighting string, one or more LED lights to emit single or multiple lighting colors, and a cover package having a driving IC to drive and control the LED lights, which is directly applicable to change one of the incandescent lamps from a traditional lighting string for replacement, and which do not change the function of the original lighting string to emit single color or different multiple colors and obviously create plenty of effect in lighting string.

Abstract: An improved LED lighting string employs a rectified and filtered device functioned as a low pass filter device to rectify input AC source into DC source providing to the LED lighting string for improving LED's flickering issue and to upgrade the optical power factor and efficiency, and luminous intensity in LED lighting string.

Abstract: A LED melody decoration kit with multicolor light sources comprises an electrical wire with a plug-connector to get a voltage from a traditional lighting string, one or more LED lights to emit single or multiple lighting colors, and a cover package having a driving IC to drive and control the LED lights, which is directly applicable to change one of the incandescent lamps from a traditional lighting string for replacement, and which do not change the function of the original lighting string to emit single color or different multiple colors and obviously create plenty of effect in lighting string.

Abstract: The present invention provides a safe light emitting device that can avoid danger of explosion and fire whenever over current or over voltage occurs. The light emitting device includes a plurality of light emitting diode lamps in series. At least one of the light emitting diode lamps is a safe light emitting diode lamp. The safe light emitting diode lamp results in a broken circuit when either over current or over voltage in the light emitting device occurs. Through the incorporation of the safe light emitting diode lamp, the series light emitting device will automatically fail whenever over current or over voltage occurs and thus be prevented from explosion and fire.

Abstract: The present invention provides a safe light emitting device that can avoid danger of explosion and fire whenever over current or over voltage occurs. The light emitting device includes a plurality of light emitting diode lamps in series. At least one of the light emitting diode lamps is a safe light emitting diode lamp. The safe light emitting diode lamp results in a broken circuit when either over current or over voltage in the light emitting device occurs. Through the incorporation of the safe light emitting diode lamp, the series light emitting device will automatically fail whenever over current or over voltage occurs and thus be prevented from explosion and fire.