Abstract: The present invention relates to a flat-panel speaker, and more particularly, to a flat-panel speaker having a multilayer PCB pattern voice coil film, which enables induced electromotive force to be increased by controlling the impedance of the multilayer voice coil film. The flat panel speaker having the multilayer PCB pattern voice coil film according to the present invention is characterized in that the voice coil comprises: a PCB (printed circuit board) pattern printed thereon and voice coil films stacked in an even number of 4 layers or more. Two layers each of said voice coil films are mutually connected in series, and the serially-connected voice coil films are connected to each other in parallel.

Abstract: The present invention relates to a voice film having a multi-layered structure for a flat panel speaker, including a PCB configured to have permanent magnets disposed on the left and right sides thereof, to have a voice coil patterned therein and disposed between the permanent magnets on the left and right sides so that the voice coil is vibrated up and down, and to have a PCB structure of a stack structure and coil patterns formed on surfaces of the highest PCB, one or more intermediate layer PCBs, and the lowest PCB in the form of a consecutive spiral track, wherein the start points of coil patterns of adjacent PCBs formed in layers, from among the coil patterns, are shorted through a via hole and are bonded to the respective end points of the coil patterns of the adjacent PCBs at the end points of the coil patterns.

Abstract: The present invention relates to a voice film having a multi-layered structure for a flat panel speaker, including a PCB configured to have permanent magnets disposed on the left and right sides thereof, to have a voice coil patterned therein and disposed between the permanent magnets on the left and right sides so that the voice coil is vibrated up and down, and to have a PCB structure of a stack structure and coil patterns formed on surfaces of the highest PCB, one or more intermediate layer PCBs, and the lowest PCB in the form of a consecutive spiral track, wherein the start points of coil patterns of adjacent PCBs formed in layers, from among the coil patterns, are shorted through a via hole and are bonded to the respective end points of the coil patterns of the adjacent PCBs at the end points of the coil patterns.