Abstract: Methods and apparatuses for measurement of residual stresses are provided. For example, a method includes indenting a first portion of a sample having residual stress and generating a residual stress reference zone at a second portion of the sample. Indenting and generating a residual stress reference zone may be performed in situ (e.g., on the same instrument platform, etc.). The present disclosure also provides a method for generating a residual stress reference, the method including providing a first sample having a residual stress and reducing the residual stress in at least a portion of the sample, wherein reducing the residual stress includes raster scanning wear, or exposure to laser energy, ion beam energy, electron beam microscopy, scanning probe microscopy, scanning electron microscopy, heat energy, vibration energy; and exposing the sample to ultrasonic energy.
Type:
Grant
Filed:
March 27, 2015
Date of Patent:
March 20, 2018
Assignee:
EXPONENTIAL BUSINESS AND TECHNOLOGIES COMPANY
Abstract: Methods and apparatuses for measurement of residual stresses are provided. For example, a method includes indenting a first portion of a sample having residual stress and generating a residual stress reference zone at a second portion of the sample. Indenting and generating a residual stress reference zone may be performed in situ (e.g., on the same instrument platform, etc.). The present disclosure also provides a method for generating a residual stress reference, the method including providing a first sample having a residual stress and reducing the residual stress in at least a portion of the sample, wherein reducing the residual stress includes raster scanning wear, or exposure to laser energy, ion beam energy, electron beam microscopy, scanning probe microscopy, scanning electron microscopy, heat energy, vibration energy; and exposing the sample to ultrasonic energy.
Type:
Application
Filed:
March 27, 2015
Publication date:
September 29, 2016
Applicant:
EXPONENTIAL BUSINESS AND TECHNOLOGIES COMPANY