Abstract: An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A perimeter of the chip is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.