Patents Assigned to EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
  • Patent number: 10636550
    Abstract: A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 28, 2020
    Assignee: Exsense Electronics Technology Co., Ltd.
    Inventors: Zhaoxiang Duan, Jiankai Ye, Jun Yang, Qixing Bai, Limin Tang
  • Patent number: 10330539
    Abstract: A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 25, 2019
    Assignee: EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Wenting Chen, Zhaoxiang Duan, Jun Yang, Qixing Bai, Limin Tang, Jiankai Ye
  • Publication number: 20170211991
    Abstract: A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
    Type: Application
    Filed: July 23, 2015
    Publication date: July 27, 2017
    Applicant: EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Wenting Chen, Zhaoxing Duan, Jun Yang, QIXING BAI, LIMIN TANG, JIANKAI YE