Patents Assigned to EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
  • High precision high reliability and quick response thermosensitive chip and manufacturing method thereof
    Patent number: 10330539
    Abstract: A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 25, 2019
    Assignee: EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Wenting Chen, Zhaoxiang Duan, Jun Yang, Qixing Bai, Limin Tang, Jiankai Ye
  • HIGH PRECISION HIGH RELIABILITY AND QUICK RESPONSE THERMOSENSITIVE CHIP AND MANUFACTURING METHOD THEREOF
    Publication number: 20170211991
    Abstract: A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
    Type: Application
    Filed: July 23, 2015
    Publication date: July 27, 2017
    Applicant: EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Wenting Chen, Zhaoxing Duan, Jun Yang, QIXING BAI, LIMIN TANG, JIANKAI YE