Patents Assigned to EXTOLCO.,LTD.
  • METHOD FOR FORMING THROUGH-VIA METAL WIRING
    Publication number: 20240080993
    Abstract: A method for forming through-via metal wiring is disclosed. According to the method, through-via metal wiring can be formed with excellent plating quality without an expensive sputtering process by bonding a metal foil to one side of a substrate having a through-via formed therein and using the foil as a metal seed layer.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 7, 2024
    Applicant: EXTOLCO.,LTD.
    Inventors: Sung Woong KIM, Wook Hwan, Nam-jin Kim, Yong-chae NA