Patents Assigned to eYs3D Microelectronics, Co.
  • Patent number: 9456202
    Abstract: An attachable three-dimensional scan module includes an attachable unit, at least two image sensing units, a depth map generation unit, and an output interface. The attachable unit fixes the attachable three-dimensional scan module on a mobile device. When the mobile device is moved around an object, a first image sensing unit and a second image sensing unit of the at least two image sensing units capture a plurality of first images including the object and a plurality of second images including the object, respectively. A plurality of depth maps generated by the depth map generation unit, the plurality of first images, and the plurality of second images are used for generating a color three-dimensional scan result corresponding to the object. The output interface outputs the color three-dimensional scan result, or the plurality of first images, the plurality of second images, and the plurality of depth maps.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: September 27, 2016
    Assignee: eYs3D Microelectronics, Co.
    Inventors: Chao-Chun Lu, Le-Shan Hsueh, Wen-Kuo Lin
  • Patent number: 9373035
    Abstract: An image capturing method includes providing at least three image capturing devices arranged along a same direction and an image processor, the at least three image capturing devices capturing at least three first images, determining a target object in the at least three first images, activating a first pair of image capturing devices of the at least three image capturing devices according to shooting angles of the target object in the at least three first images in order to capture a first pair of motion images, and the image processor performing image recognition to the target object of the first pair of motion images.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: June 21, 2016
    Assignee: eYs3D Microelectronics, Co.
    Inventors: Ben Wu, Ming-Che Ho, Chih-Kao Chen