Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.
Type:
Grant
Filed:
December 25, 2014
Date of Patent:
December 6, 2016
Assignee:
EZEK LAB COMPANY LIMITED
Inventors:
Sheng-Che Huang, Yu-Tse Liu, Wei-Han Hu, Chien-Hung Lee