Abstract: A data carrier such as a smart card comprising an antenna module (AM) and a booster antenna (BA). The booster antenna (BA) has an outer winding (OW) and an inner winding (IW), each of which has an inner end (IE) and an outer end (OE). A coupler coil (CC) is provided, connecting the outer end (OE, b) of the outer winding (OW) and the inner end (IE, e) of the inner winding (IW). The inner end (IE, a) of the outer winding (OW) and the outer end (OE, f) of the inner winding (IW) are left un-connected (free floating). The coupler coil (CC) may have a clockwise (CW) or counter-clockwise (CCW) sense which is the same as or opposite to the sense (CW or CCW) of the outer and inner windings. Various configurations of booster antennas (BA) are disclosed.

Abstract: A portion of the surface of a substrate may be prepared for mounting an antenna wire such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to the pattern for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining or removing material from adjacent the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points, securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document.

Abstract: A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a “quasi-dipole”. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).

Abstract: Microstructures such as connection areas, contact pads, antennas, coils, plates for capacitors and the like may be formed using nanostructures such as nanoparticles, nanowires and nanotubes. A laser may be used to assist in the process of microstructure formation, and may also be used to form other features on a substrate such as recesses or channels for receiving the microstructures. A smart mobile phone sticker (MPS) mounted to a cell phone with a self-sticking shielding element comprising a core layer having ferrite particles.

Abstract: A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed.