Abstract: A bonding tool is attached to a transducer of an ultrasonic bonder with several screws, at least two of which are advantageously disposed at different heights when the transducer is in its operating position. The transducer may comprise a bore in which the bonding tool is disposed. The bore may have a circumference that is expanded away from the transducer's free end.

Abstract: A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool under pressure and the action of ultrasound and/or heat. After the bonded connection has been created, the bonding head or the bonding tool is raised a short distance away from the bonding site, the bonding wire is firmly gripped by the wire clamp and the bonding head. The wire clamp with bonding wire gripped therein is raised for a second distance, during which process the tensile force acting on the bonding wire is detected.

Abstract: Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder having a camera with a downstream image processing device for recording and processing an image of its working region at a workpiece.

Abstract: Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.

Abstract: Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded connection.

Abstract: Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making external contact and the upper surface of which is electrically connected to circuit contact elements on the lower surface of the circuit, wherein a housing lid is provided, in particular opposite the housing floor, which presses the circuit with the circuit contact element resiliently against the upper surface of the housing floor, and between the circuit contact elements and the housing floor there is no connection that fixes their materials permanently together.

Abstract: Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding contact area, wherein the knife is mounted so as to be yielding with respect to the movement component perpendicular to the substrate surface, so that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.

Abstract: A bonding machine chip-transferring station, with a multi-axial positioning mechanism and a suction-needle module mounted and positionable thereon, with a housing, a suction needle connected to a vacuum conduit, and a suction-needle conveyance unit, including a drive motor, a belt transmission coupled thereto, and a suction-needle reversal means driven by the transmission, wherein the suction-needle reversal means includes a suction-needle holder seated on an axle and a pulley nonrotatably connected to the axle, where the suction-needle holder includes a guide block on which is mounted a suction-needle carriage movable only in the Z direction, supports the suction needle, and bears a carrier bolt oriented parallel to the axle, and an actuator fork nonrotatably connected to the pulley, via the axle, with which is engaged the carrier bolt extending from the suction-needle carriage and by means of which the suction-needle carriage is driven and constrained exclusively in the ±Z directions.

Abstract: A method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.

Abstract: Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded connection.

Abstract: This invention relates to a wire bonding apparatus for bonding wire to a substrate wherein the components used to guide, bond and cut the wire have a reduced cross-sectional dimension near the substrate to enable close proximity, deep access, fine pitch bonding. This is accomplished in part by forming a wire guide integrally through a substantial portion of the bonding tool, thereby completely eliminating one component found in conventional wire bonding apparatus. This is further accomplished by tapering the size of the bonding tool toward the substrate such that the bonding tool in a lower portion has a smaller cross-sectional area. A cutter extends adjacent the lower portion of the bonding tool and into the area that would otherwise be occupied by the lower portion of the bonding tool if not for the taper. Thus, both the cutter and the lower portion of the bonding tool occupy a minimal amount of space adjacent the substrate.

Abstract: A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is biased by a spring mounted at one end to a linear motor for adjustment of the urging force of the spring. The actual force applied to the wire is measured by detecting means. Control means are provided which are connected to the linear motor for adjusting the urging force of the spring, to thereby obtain a desired pressure to be applied to the wire.

Abstract: A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system (7, 8, 9) is provided for simultaneously securing the transducer (3) to the bonding head frame (12) and variably adjusting the contacting pressure of the wire to the substrate. Springs (9a, 9b), preferably leaf springs, urge the transducer (3), while a linear actuator (8) is arranged to variably tension the springs (9a, 9b) to adjust the bond force.

Abstract: A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bonding wire to the wedge. Securement means are integrally formed with the guide body for releasably mounting the guide. The securement means are formed such that movement of the guide body with respect to the bonding head allows its release.

Abstract: A bonding head for an ultrasonic bonding machine comprises a wedge operatively associated with an ultrasound transducer by means of which an electrically conducting wire can be pressed against a contact surface of an electrical or electronic component and bonded thereto by ultrasonic excitation of the wedge. A wire clamp is located adjacent to and ahead of the wedge and can be moved back and forth by drive means in the direction of the wire being fed to the wedge. The wedge can be moved up and down together with the wire clamp and its drive means in a direction substnatially perpendicular to the contact surface. The bonding head as a whole is also disposed so that it can be swung about an axis perpendicular to the contact surface. The drive means for wire clamp comprises a translational drive which can move the wire clamp exactly parallel to the direction of the wire being fed to the wedge.

Abstract: A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic transducer 6, the bonding tool 2 being arranged to press the wire 8 against the contact surface of the electrical or electronic component 10, and monitoring the deformation of the wire 8. The level and duration of the supply of ultrasonic energy and optionally the magnitude of the bonding force are continuously controlled during the bonding process in response to the deformation of the wire, in a closed loop system.

Abstract: A device for incorporation in a wire bonding machine for monitoring the supply of wire from a wire supply spool to a bonding wedge. The device includes a mount (12) for rotatably mounting a wire supply spool (1); a guide wheel (7) mounted on a lever (8), which lever (8) can be deflected between a first position to which it is biassed by a spring (10) and a second position at which it activates sensor (A); and a motor (3) for driving the wire supply spool (1), which motor (3) is started by the sensor (A) when the sensor is activated by the lever (8). The device further comprises a means for stopping the motor (3) when a predetermined amount of wire (6) has been supplied. The wire (6) passes over the guide wheel (7) between the wire supply spool (1) and the bonding wedge so that the consumption of wire during a bonding cycle causes deflection of the lever (8) from its first position to its second position.