Abstract: Provided is a semiconductor device using a p-type oxide semiconductor layer and a method of manufacturing the same. The device includes the p-type oxide layer formed of at least one oxide selected from the group consisting of a copper(Cu)-containing copper monoxide, a tin(Sn)-containing tin monoxide, a copper tin oxide containing a Cu—Sn alloy, and a nickel tin oxide containing a Ni—Sn alloy. Thus, transparent or opaque devices are easily developed using the p-type oxide layer. Since an oxide layer that is formed using a low-temperature process is applied to a semiconductor device, the manufacturing process of the semiconductor device is simplified and manufacturing costs may be reduced.
Type:
Application
Filed:
May 5, 2015
Publication date:
August 20, 2015
Applicants:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, FACULTY OF SCIENCE AND TECHNOLOGY NEW UNIVERSITY OF LISBON
Inventors:
Sang Hee PARK, Chi Sun HWANG, Chun Won BYUN, Elvira M.C. FORTUNATO, Rodrigo F.P. MARTINS, Ana R.X. BARROS, Nuno F.O. CORREIA, Pedro M.C. BARQUINHA, Vitor M.L. FIGUEIREDO
Abstract: Provided is a semiconductor device using a p-type oxide semiconductor layer and a method of manufacturing the same. The device includes the p-type oxide layer formed of at least one oxide selected from the group consisting of a copper(Cu)-containing copper monoxide, a tin(Sn)-containing tin monoxide, a copper tin oxide containing a Cu—Sn alloy, and a nickel tin oxide containing a Ni—Sn alloy. Thus, transparent or opaque devices are easily developed using the p-type oxide layer. Since an oxide layer that is formed using a low-temperature process is applied to a semiconductor device, the manufacturing process of the semiconductor device is simplified and manufacturing costs may be reduced.
Type:
Grant
Filed:
April 14, 2011
Date of Patent:
June 9, 2015
Assignees:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, FACULTY OF SCIENCE AND TECHNOLOGY NEW UNIVERSITY OF LISBON
Inventors:
Sang Hee Park, Chi Sun Hwang, Chun Won Byun, Elvira M. C. Fortunato, Rodrigo F. P. Martins, Ana R. X. Barros, Nuno F. O. Correia, Pedro M. C. Barquinha, Vitor M. L. Figueiredo
Abstract: Provided is a semiconductor device using a p-type oxide semiconductor layer and a method of manufacturing the same. The device includes the p-type oxide layer formed of at least one oxide selected from the group consisting of a copper(Cu)-containing copper monoxide, a tin(Sn)-containing tin monoxide, a copper tin oxide containing a Cu—Sn alloy, and a nickel tin oxide containing a Ni—Sn alloy. Thus, transparent or opaque devices are easily developed using the p-type oxide layer. Since an oxide layer that is formed using a low-temperature process is applied to a semiconductor device, the manufacturing process of the semiconductor device is simplified and manufacturing costs may be reduced.
Type:
Application
Filed:
April 14, 2011
Publication date:
October 20, 2011
Applicants:
FACULTY OF SCIENCE AND TECHNOLOGY NEW UNIVERSITY OF LISBON, ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Inventors:
Sang Hee Park, Chi Sun Hwang, Chun Won Byun, Elvira M.C. Fortunato, Rodrigo F.P. Martins, Ana R.X. Barros, Nuno F.O. Correia, Pedro M.C. Barquinha, Vitor M.L. Figueiredo