Abstract: A method for sampling a workpiece and for retaining the sample in the workpiece so that it may be retrieved by using a semi-spherical cutting blade rotated about its central axis and articulated about an axis perpendicular thereto such that the cutting action follows a single arcuate path enabling a cut to be made in a workpiece which is relatively shallow and smooth, thereby providing under normal circumstances a non-destructive, partial-spherical recess in the workpiece sampled which does not have to be repaired before placing the workpiece back into service, while at the same time forming a sample of significant depth and size adequate for accurate analysis.

Abstract: A device, utilizing a unique hemispherical cutter to remove a sample of material and to retain the sample of material for retrieval. The cutter is mounted on a chassis which can travel along the interior or exterior of the device to be sampled. The carriage can be maintained in a fixed position relative to the structure being sampled. After positioning of the cutter carrying carriage the cutter blade is pivoted into engagement with the surface. The blade penetrates the surface and removes a sample in a single continuous cut, leaving a shallow dimple. The sample is then retrieved through the return of the cutter and carriage from the device being sampled.