Patents Assigned to Fairchild Semiconductor Corporatio
  • Semiconductor die package including IC driver and bridge
    Patent number: 8674490
    Abstract: A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: March 18, 2014
    Assignee: Fairchild Semiconductor Corporatio
    Inventors: Yong Liu, Jiangyuan Zhang, Qiuxiao Qian