Patents Assigned to Fairchiled Semiconductor Corporation
  • MEMS MULTI-AXIS GYROSCOPE WITH CENTRAL SUSPENSION AND GIMBAL STRUCTURE
    Publication number: 20130139591
    Abstract: Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.
    Type: Application
    Filed: January 31, 2013
    Publication date: June 6, 2013
    Applicant: Fairchiled Semiconductor Corporation
    Inventor: Cenk Acar
  • High directivity ultra-compact coupler
    Patent number: 7564325
    Abstract: A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: July 21, 2009
    Assignee: Fairchiled Semiconductor Corporation
    Inventors: Abid Hussain, Daniel J. Donoghue, Eric S. Gray