Abstract: An improvement to a lead forming system that provides quick changeover without complete disassembly. By removing a pair of fasteners securing a pair of die inserts, a spring pack in an upper die unit can be freely rotated and interchanged or modified. The spring pack has a plurality of chamfers that allow the spring pack to rotate within the die pack until a narrower side is presented for removal. Straightforward access to the cutting units is afforded when the spring pack is removed. Risk of damage to various components of the lead forming system is minimized and the precision and accuracy of the new setup is increased because the system was minimally disassembled. A method for removing the spring pack in the upper die unit is fully disclosed.

Abstract: Leads of an electronic component are formed in a Z-shaped configuration so as to provide a constant distance from the bottom surface of the body to the foot of the formed lead by a device having a lower floating anvil and complementary upper die unit, each of which have clamping and forming surfaces defining a Z-shaped joint therein between. The clamping surfaces are moveable relative to the forming surfaces of the anvil and the degree of movement which is permitted is controlled by preset sensing means responsive to contact with the body of the electronic component so as to produce the desired vertical distance between foot portion of the lead and the bottom surface of the component.