Abstract: An injection molding apparatus and a method of encapsulating integrated circuits which include a plurality of molding presses, such as transfer molding presses for encapsulating integrated circuits, which are mounted on an indexable rotary table. Stationary loading and unloading stations are arranged at spaced angular locations around the table for loading an insert into the mold cavities. A controller is provided to rotate with the molding presses for individually controlling function thereof such as opening and closing of the presses and temperature and pressure in the molds.

Abstract: An integrated circuit encapsulation apparatus comprises a molding press, which has a mold defining a cavity adapted to receive an integrated circuit die and an attached leadframe for encapsulation thereof. The molding press is operable by an electro-pneumatic driving mechanism which utilises a geared servo motor for opening and closing the mold, and a pneumatic cylinder for providing clamping pressure. Both the servo motor and pneumatic cylinder act upon a threaded screw member for movement of the molding press. The press is provided with an integrated mold brushing unit which has transversely rotating brushes and travels over the mold faces to remove debris. In a further refinement, a spring-loaded bearing system is provided for easy removal of the mold.