Abstract: According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.

Abstract: The hydraulic substance according to the present invention comprises a certain amount of solid particles A (such as portland cement and mixed cement comprising portland cement), an average diameter thereof is 5 to 50 .mu.m, and solid particles B (such as silica fume comprising amorphous silica), an average diameter thereof is less than 1/5 of the particles A, and the particles B have such characteristic that they cohere to the surfaces of the particles A in water, and the quantity of the particles B is arranged such that they cover at least to make a single layer over the whole or part of surfaces of the particles A to cover whole or part of surfaces of particles A with particles B at least with a single layer, and the quantity of the water is arranged such that it is less than 60% of the total amount of the particles A and particles B.