Abstract: Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component.

Abstract: Disclosed are an electrical connector and a method for providing transmit and receive electrical signal contacts to reduce or minimize total crosstalk. Such methods may be particularly suitable for connectors having larger near-end crosstalk aggressors than far-end crosstalk aggressors. The electrical signal contacts may be subdivided on a substrate, such as a midplane PCB, and through the opposing connectors, such that the transmitting contacts are all on one side of the connector and the receiving contacts are on the other side of the connector, with a buffer between them. The buffer may comprise a plurality of “dummy” or “buffer” contacts, which may be unassigned or devoid of electrical connectivity. This is one step beyond the primary assignment of contacts as single-ended or differential signal contacts. The contacts themselves may also receive a secondary assignment according to their desired transmitting, receiving, or buffering function.

Abstract: Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component.

Abstract: Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component.

Abstract: Disclosed herein are a method and an apparatus for providing a high efficiency seal in an electrical connector. The seal provides an impediment to the passage of fluid at one end of the electrical connector to the environment at the other end of the electrical connector. The electrical connector may be incorporated into an over-mold that contains other components. The electrical connector achieves the highly efficient seal through a combination of a dual torturous path design, incorporation of melt ribs, and may further involve the technique of impregnation.

Abstract: This invention relates to an improved power connector that has a housing comprising a plurality of slots that are each for receiving a receptacle contact. Preferably, the housing has a plurality of quick-disconnect contacts each disposed in one of the housing slots. Further, a cover, may be coupled to the housing, and the housing may comprise a top portion and a bottom portion. A strain relief member, may be disposed between the cover top and bottom portions. A plurality of cables extend through the channels disposed in the strain relief members and are attached to the housing quick disconnects. A latching spring assembly that may comprise two latching springs is coupled to the housing and attaches the power cable connector to a receptacle connector, such as a right-angle or straight board connector.

Abstract: A compression tool including a ram; a drive system, a battery and a user selectable retraction control. The drive system is connected to the ram to extend the ram and allow retraction of the ram. The battery is connected to the drive system to at least partially power the drive system. The user selectable retraction control is connected to the drive system. The user selectable retraction control includes a plurality of ram retraction settings which are adapted to be selected by a user to at least partially control respective different retraction stopping locations of the ram.

Abstract: A disk drive interposer may include a component board assembly, and an interconnect board. The component board assembly may have a plurality of electrical components electrically connected by a first set of electrically conductive traces. The interconnect board may have a first plurality of electrically-conductive pads disposed along a disk drive mating edge of the interconnect board and a second plurality of electrically-conductive pads disposed along a backplane mating edge of the interconnect board. The first plurality of pads may be electrically connected to the second plurality of pads by a second set of electrically conductive traces. A mezzanine connector may electrically connect the first set of traces and the second set of traces. Such an interposer may physically and electrically mimic a disk drive from the frame of reference of a backplane, and physically and electrically mimic a backplane from the frame of reference of a disk drive.

Abstract: Embodiments of electrical connectors include substantially identical first and second halves. The first and second halves each include insert molded leadframe assemblies that comprise electrical conductors. Each electrical conductor of the first half engages a substantially identical electrical conductor of the second half when the first and second halves are mated.

Abstract: A pickup cap for an electrical connector is disclosed. The pickup cap may include a planar body portion and a plurality of opposing legs extending from a side of the body portion. A respective friction pad may extend from each leg. The friction pads may be received into complementary slots in the housing of an electrical connector. Friction between the friction pads and walls that define the slots may be sufficient to secure the pickup cap to the connector. The planar body portion may include a pickup portion. When the pickup cap is received into the connector housing, the legs may bow slightly. The pickup portion, however, may remain generally planar, and generally parallel to the mating plane defined by the vertical connector, even when the pickup cap is fully inserted into the connector housing.

Abstract: An electrical connector including a plurality of electrical contacts; and a housing. The housing includes a pre-mold housing member which has been overmolded onto the electrical contacts; and an overmold housing member which has been overmolded onto the electrical contacts and the pre-mold housing member. The pre-mold housing member comprises an exterior sealing surface which is not covered by the overmold housing member. The exterior sealing surface of the pre-mold housing member loops around an exterior lateral side of the housing which is between front and rear ends of the housing.

Abstract: Disclosed herein is a grounding connector. The grounding connector includes a female member, a male member, and a threaded member. The female member includes a first clamp section, a conductor connection section, and a center section between the first clamp section and the conductor connection section. The center section includes a first opening. The male member includes a barrel section, a second clamp section, and a web section between the barrel section and the second clamp section. The barrel section includes a threaded opening. The threaded member extends through the first opening. The threaded member is engaged with the threaded opening.

Abstract: A compressible electrical contact is disclosed. The compressible electrical contact may include a nose portion, a corrugated portion and a tail portion. The tail portion may extend from a first end of the corrugated portion and the nose portion may extend from an opposite end of the corrugated portion. The corrugated portion may define a first surface and a second surface opposite the first surface. The first and second surfaces may have a width. The corrugated portion may also have a third surface extending between the first and second surfaces and a fourth surface opposite the third surface. A plurality of corrugations may be formed in the third and fourth surfaces of the corrugated portion.

Abstract: Disclosed are blade contacts that may be suitable for mating with ?TCA-standard receptacle contacts. Such a blade contact may define a body portion, and a tab portion extending from a mating end of the body portion. The tab portion may be a tapered tab portion that tapers from a first width at the mating end of the body portion to a second, lesser width at a distal end of the tab portion. The body portion may define a single beam portion from which the tab portion and one or more terminal pins extend. Alternatively, the body portion may define a first beam portion from which the tab portion extends, and a second beam portion from which the terminal pins extend. Thus, the body portion may be generally L-shaped. Electrical connectors including such contacts are also disclosed.

Abstract: An electrical connector may include a connector housing and a plurality of identical leadframe assemblies received in the connector housing. Each of the leadframe assemblies may define a leadframe mating sequence. The leadframe assemblies may be arranged relative to one another to define a connector mating sequence that differs from the leadframe mating sequence. Each leadframe assembly may define a leadframe mounting footprint. The leadframe assemblies may be arranged relative to one another such that the leadframe mounting footprints are staggered, i.e., offset relative to one another.

Abstract: A cover for an electrical connector includes substrate mounting beams. When a force is applied to the top, the beams transfer the force to the lead frame, pressing contacts of the connector to an electrical device such as a substrate. Flat rock application may be applied to the top of the cover to connect the connector to a substrate. The cover may aid in retaining the lead frame assemblies in the connector. A cover for an electrical connector may include a back extending from a top such that the back includes resiliency and is able to be flexed while the cover is placed on a connector and flexed to remove the cover from the connector.