Abstract: Electrical connector assemblies are provided that include electrical connectors having electrical contacts that have receptacle mating ends are provided. The connector housings of the provided electrical connectors include alignment members that are capable of performing staged alignment of components of the electrical connector assemblies. The provided electrical connector assemblies and the electrical connectors provided therein are capable of operating at a data transfer rate of forty gigabits per second with worst case multi-active cross talk that does not exceed a range of about two percent to about four percent.

Abstract: An electrical connector including a housing having a deflectable cantilevered mating connector latch arm, electrical contacts connected to the housing; and a connector position assurance (CPA) member movably mounted to the housing between an open position and a closed position. The CPA member comprising a top section and two downwardly extending rails. Each rail has a bottom end adapted to contact a shorting clip of a mating electrical connector and move the shorting clip off of connection with contacts of the mating electrical connector. The first rail includes a wedge surface and a detent locating surface. The wedge surface is adapted to be contacted by the mating electrical connector to deflect the first rail. When the CPA member is moved to the closed position, the detent locating surface is adapted to be positioned below a detent surface of the housing to retain the CPA member in the closed position.

Abstract: A high density connector comprises a receptacle housing having a base wall and at least one lateral wall defining a cavity. The lateral wall is configured to nest within a plug housing. A high density array of female electrical contacts is arranged in the cavity which are supported in the base wall and extend unsupported above the base wall to a given height. A single piece protection member is arranged in the cavity adjacent the base wall. The protection member has an array of openings in which the electrical contacts extend. The protection member has a thickness selected so that the electrical contacts do not extend beyond an outer face of the protection member.

Abstract: An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate.

Abstract: An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate.