Abstract: A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed.

Abstract: A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a “quasi-dipole”. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).

Abstract: A smart card having a multi-layer substrate; a transponder module disposed in a first layer of the multi-layer substrate; a first antenna disposed in the first layer of the multi-layer substrate; and a second antenna disposed in a second layer of the multi-layer substrate. A switch and a capacitor in series with the second antenna. The first antenna may be tuned to a different frequency than the second antenna. An RFID chip and antenna in a mold mass disposed in a recess in the first layer of a substrate, behind a hologram disposed on the first layer of the substrate. The switch for the second antenna disposed under the RFID chip. A layer of ferrite material disposed between the hologram and the RFID chip. LEDs disposed behind the hologram.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.