Abstract: Provided is an electrostatic chuck including: a base material; an adsorption unit for adsorbing a wafer by using electrostatic force; an adhesive layer for adhering the adsorption unit to the base material; and an adhesive layer anti-corrosion coating layer provided to cover an exposed surface of the adhesive layer, wherein the adhesive layer anti-corrosion coating layer has no pores or cracks since the adhesive layer anti-corrosion coating layer is made by a method of spraying and coating, at conditions of 0-50° C.

Abstract: The present invention relates to a metal oxide layer structure formed on the surface of a substrate, in which the atomic numbers of the element metal and the element oxygen in the metal oxide layer are in a non-stoichiometric ratio, so that the metal oxide layer has a high density corresponding to 90-100% of the metal oxide before coating and is free of cracks and pores. The metal oxide layer structure is formed of a metal oxide represented by XaYb (X: a metal element, Y: the element oxygen, a: the atomic number of the metal element, and b: the atomic number of the element oxygen), and the atomic percent of the metal element is greater than {a/(a+b)}×100(%). The layer structure is formed of nano-crystalline particles and nano-amorphous particles, and the particles forming the layer structure do not undergo heat-induced growth and heat-induced conversion to crystalline particles.

Abstract: Provided is an apparatus and a method of spray-coating solid powder on a substrate disposed in a coating chamber which is in a vacuum state, and more particularly, to an apparatus and a method for coating solid powder, which are configured such that a gas sucked from an atmospheric pressure gas, together with a gas supplied from a gas supply unit, can be used as a carrier gas for transporting the solid powder.

Abstract: Provided is a processing component of equipment for manufacturing a semiconductor or a display. A ceramic coated film is formed on a surface of a body of the processing component, in a state in which some or the entirety of valleys and peaks are removed, such that a surface roughness Rz, which is expressed as an absolute value (P1+P2+P3+P4+P5)/5?(V1+V2+V3+V4+V5)/5 corresponding to a difference between an average of distances between the deepest five valleys V1, V2, V3, V4 and V5 in a section in which the surface roughness is measured and an arbitrary datum line that is parallel to a center line at which an area of peaks and an area of valleys are equal to each other in the section in which the surface roughness is measured and an average of distances between the highest five peaks P1, P2, P3, P4 and P5 in the section in which the surface roughness is measured and the arbitrary datum line, is lower than 5.0 ?m.

Abstract: The present invention relates to a method and an apparatus by which powder is evenly dispersed and is coated on a substrate uniformly and continuously so that a uniform layer may be formed. More specifically the present invention provides a method and an apparatus for forming a coating layer that powder is coated on an entire surface of a substrate uniformly and continuously, regardless of the material or the size of the substrate, as a uniform amount of powder entrained on the carrier air which is generated by carrier air and powder transported to a carrier pipe at a certain rate is consistently fed in to a nozzle, regardless of the size, morphology, and specific weight of the powder particles.

Abstract: The present invention relates to a method and an apparatus by which powder is evenly dispersed and is coated on a substrate uniformly and continuously so that a uniform layer may be formed. More specifically the present invention provides a method and an apparatus for forming a coating layer that powder is coated on an entire surface of a substrate uniformly and continuously, regardless of the material or the size of the substrate, as a uniform amount of powder entrained on the carrier air which is generated by carrier air and powder transported to a carrier pipe at a certain rate is consistently fed in to a nozzle, regardless of the size, morphology, and specific weight of the powder particles.