Abstract: Provided is a plasma-resistant two-layer coating film structure including: a ceramic or metal substrate having pits on a surface thereof; a first coating layer which is a ceramic coating layer formed without cracks on the surface of the substrate by a spray coating method other than thermal spray, the layer being coated to fill the pits on the surface of the substrate, fine pits accompanying ceramic particle bonding being formed on the surface, and the layer including ceramic polycrystalline bodies having a crystallite size of less than 300 nm; and a second coating layer which is a plasma resistant ceramic film, the layer being formed to have a surface roughness (Ra) of 0.2 ?m or less without a separate grinding process and coated to cover the fine pits to form a surface in which positions that may serve as starting points of plasma etching are minimized.

Abstract: The present invention relates to a metal oxide layer structure formed on the surface of a substrate, in which the atomic numbers of the element metal and the element oxygen in the metal oxide layer are in a non-stoichiometric ratio, so that the metal oxide layer has a high density corresponding to 90-100% of the metal oxide before coating and is free of cracks and pores. The metal oxide layer structure is formed of a metal oxide represented by XaYb (X: a metal element, Y: the element oxygen, a: the atomic number of the metal element, and b: the atomic number of the element oxygen), and the atomic percent of the metal element is greater than {a/(a+b)}×100(%). The layer structure is formed of nano-crystalline particles and nano-amorphous particles, and the particles forming the layer structure do not undergo heat-induced growth and heat-induced conversion to crystalline particles.

Abstract: Provided is an apparatus and a method of spray-coating solid powder on a substrate disposed in a coating chamber which is in a vacuum state, and more particularly, to an apparatus and a method for coating solid powder, which are configured such that a gas sucked from an atmospheric pressure gas, together with a gas supplied from a gas supply unit, can be used as a carrier gas for transporting the solid powder.

Abstract: The present invention relates to a method and an apparatus by which powder is evenly dispersed and is coated on a substrate uniformly and continuously so that a uniform layer may be formed. More specifically the present invention provides a method and an apparatus for forming a coating layer that powder is coated on an entire surface of a substrate uniformly and continuously, regardless of the material or the size of the substrate, as a uniform amount of powder entrained on the carrier air which is generated by carrier air and powder transported to a carrier pipe at a certain rate is consistently fed in to a nozzle, regardless of the size, morphology, and specific weight of the powder particles.