Patents Assigned to Feng Chia University
  • Publication number: 20080171194
    Abstract: A heat dissipation structure is provided. The heat dissipation structure comprises a carbon substrate and a metal layer which at least partially covers the sidewall of the carbon substrate. The metal layer covering the carbon substrate can not only increase the heat dissipation efficiency of the carbon substrate but can also eliminate the short circuiting of the elements when dust accumulates on them.
    Type: Application
    Filed: May 30, 2007
    Publication date: July 17, 2008
    Applicant: FENG CHIA UNIVERSITY
    Inventors: Tse-Hao Ko, Wen-Shyong Kuo, Hsin-Fang Lu, Su-Ching Yen, Yi-Lung Chiang
  • Patent number: 7390476
    Abstract: A carbon fiber paper manufacturing process and construction has oxidized fiber as raw material needle punched into a construction of 0.1˜20 mm thick, 5˜500 g/m2 oxidized fiber felt of weight, then impregnated in high density epoxy, hot compressed and hardened, then finally carbonization processed at temperature range of 700˜3000° C. to yield porous carbon fiber paper with high resilience, low porosity, and flexure, and low surface resistance to be used as the substrate of porous carbon electrode in fuel battery.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: June 24, 2008
    Assignee: Feng Chia University
    Inventors: Tse-Hao Ko, Yuan-Kai Liao
  • Publication number: 20080044656
    Abstract: A carbonaceous composite particle comprises a graphite particle and a layer of amorphous carbon structure covering the graphite particle, wherein the graphite particle is a graphitized mesocarbon microbead, a natural graphite particle, or a synthesized graphite particle. The composite particle is useful in a secondary cell, and is useful in providing a lithium-ion secondary cell having both a high charge capacity and a low irreversible capacity.
    Type: Application
    Filed: October 5, 2006
    Publication date: February 21, 2008
    Applicant: Feng Chia University
    Inventors: Tse-Hao Ko, Jia-Hung Wei
  • Publication number: 20080045413
    Abstract: A method for manufacturing an activated carbon fiber product comprising the steps of (a) providing an oxidized fiber product, and (b) activating the oxidized fiber product in the presence of a chemical reagent selected from a group consisting of an acid, an ammonium salt, a metallic compound, and a combination thereof. The method provides an activated carbon fiber product with a high specific surface at a relatively low temperature. The method especially provides an activated carbon fabric suitable for use as an electrode of an electric double layer capacitor.
    Type: Application
    Filed: October 5, 2006
    Publication date: February 21, 2008
    Applicant: Feng Chia University
    Inventors: Tse-Hao Ko, Yu-Tang Chen, Chung-Kai Pan
  • Publication number: 20070154779
    Abstract: The present invention relates to a porous carbon electrode substrate with a woven structure and having a property combination of a thickness ranging from 0.1 to 1.0 mm, a bending strength of 0.7 MPa or more, a porosity of 50% or more, and a surface resistivity of 1.0 ?/sq or less. The present invention also relates to a method of preparing a porous carbon electrode substrate comprising the following steps: (a) providing an oxidized fabric or pre-carbonized oxidized fabric, (b) impregnating the fabric with a resin to provide a resin material-carried fabric, (c) heating and pressing the resin material-carried fabric, and (d) carbonizing the heated and pressed fabric.
    Type: Application
    Filed: May 22, 2006
    Publication date: July 5, 2007
    Applicant: FENG CHIA UNIVERSITY
    Inventors: Tse-Hao Ko, Yuankai Liao, Ching-Han Liu, Ming-Chian Hung
  • Publication number: 20070138005
    Abstract: An electrochemical testing device for a specimen includes a receiving member, an auxiliary electrode, a work module, a clamping module, and a reference electrode. The receiving member receives an electrolytic solution and includes a surrounding wall having a bottom open end. The auxiliary electrode is mounted in the receiving member. The work module holds the specimen and includes at least one upper plate covering the open end to close the receiving member and having an opening connected fluidly to an interior of the receiving member, a lower plate, a work electrode plate interposed between and contacting the upper and lower plates, and a test specimen holding site provided at the work electrode plate and connected fluidly to the opening. The clamping module clamps the work module against the surrounding wall. The reference electrode is disposed in the receiving member above the work electrode plate.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 21, 2007
    Applicant: Feng Chia University
    Inventors: Tse-Hao Ko, Shi-Kun Chen, Kai-Hsuan Hung, Chih-Yeh Chung
  • Patent number: 7232669
    Abstract: Disclosed herein is a process for enhancing anaerobic biohydrogen production, including: adding into a reactor an organic waste containing hydrogen-producing anaerobic bacteria, a first substrate, and a carrier that permits the hydrogen-producing anaerobic bacteria to adhere and grow thereon, so as to form a mixture; acclimating the mixture at a first agitation speed ranging from 5 to 60 rpm, so that the hydrogen-producing anaerobic bacteria adhere to and proliferate on the carrier, followed by the formation of granular biomasses within the acclimated mixture; and feeding a second substrate into the reactor at a second agitation speed ranging from 5 to 60 rpm, so that the content of the granular biomasses is increased while the second substrate is anaerobically fermented by the hydrogen-producing anaerobic bacteria in the granular biomasses to result in the production of hydrogen.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 19, 2007
    Assignee: Feng Chia University
    Inventors: Ping-Jei Lin, Kuo-Shing Lee, Jo-Shu Chang, Yi-Sheng Chang, Yu-Shin Huang
  • Publication number: 20070122463
    Abstract: A wound dressing and an antimicrobial composition are provided. The wound dressing comprises a carbonaceous material, a noble metal carried on the carbonaceous material, and, optionally, a flexible base layer, wherein the carbonaceous material is selected from a group consisting of activated carbon, graphite, carbon, and a combination thereof, while the noble metal is selected from a group consisting of Ag, Au, Pd, Pt, Cu, Zn, and a mixture thereof. The antimicrobial composition is for topical use on skins and comprises the aforementioned carbonaceous material as well as the noble metal carried on the carbonaceous material.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 31, 2007
    Applicant: FENG CHIA UNIVERSITY
    Inventor: Tse-Hao Ko
  • Patent number: 7141269
    Abstract: A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: November 28, 2006
    Assignee: Feng Chia University
    Inventors: Don-Gey Liu, Tsong-Jen Yang, Chin-Hao Yang, Hong-Yuan Hsu, Wen Luh Yang, Giin-Shan Chen
  • Patent number: 7036219
    Abstract: A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an electrolytic bath; (b) oxidizing the metal substrate in the electrolytic bath to form a metal oxide layer thereon through micro-arc oxidation; (c) forming a plurality of conductive contacts on the metal oxide layer for electrical connection with the electronic component.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: May 2, 2006
    Assignee: Feng Chia University
    Inventor: Ju-Liang He
  • Publication number: 20050287669
    Abstract: Disclosed herein are nucleic acid constructs and expression vectors for enhancing the production of recombinant polypeptides/proteins, and methods for the massive production of recombinant polypeptides/proteins, in which a first nucleic acid sequence encoding thioredoxin and a second nucleic acid sequence encoding hemoglobin are cloned into a host cell, thereby enhancing the capability of the thus formed recombinant host cell in producing a selected gene product, and thereby assisting said recombinant host cell in relieving intracellular stress due to the overproduction of said gene product.
    Type: Application
    Filed: January 10, 2005
    Publication date: December 29, 2005
    Applicants: Feng Chia University (President An-Chi LIU), Taichung District Agricultural Research and Extension Station, Council of Agriculture
    Inventors: Yun-Peng Chao, Zei-Wen Wang, Po-Ting Chen, Yu-Hsin Chen
  • Publication number: 20050014006
    Abstract: A method of manufacturing an adhesiveless flexible substrate modifies a surface of an electrically insulative flexible base material by plasma polymerization technology to form a layer of plasma polymer on a surface of the electrically insulative flexible base material before plating a copper layer on the base material so as to improve the bond strength of the copper layer and the base material. Because the layer of plasma polymer has a thin thickness and excellent mechanical properties, the adhesiveless flexible substrate is highly flexible.
    Type: Application
    Filed: April 26, 2004
    Publication date: January 20, 2005
    Applicant: Feng-Chia University
    Inventor: Yung-Sen Lin
  • Patent number: 6838116
    Abstract: A solvent, such as deionized water, is heated up to boil to remove the oxygen dissolved in the water before preparing the plating solutions for the growth of copper interconnects. The resistance of the copper grown from the EDD solutions having undergone the oxygen-removing process is greatly improved, down to a value very close to copper's ideal value.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: January 4, 2005
    Assignee: Feng Chia University
    Inventors: Don-Gey Liu, Tsong-Jen Yang, Chin-Hao Yang, Wen Luh Yang, Giin-Shan Chen
  • Patent number: 6652980
    Abstract: A method for forming an electrochromic material includes the steps of (a) forming a transparent conductive film on a transparent substrate, (b) forming a metal film on the transparent conductive film by electroless plating, and (c) oxidizing the metal film to form a metal oxide film, which exhibits electrochromic characteristics on the transparent conductive film.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: November 25, 2003
    Assignee: Feng Chia University
    Inventors: Shu-Yii Wu, Wen-Feng Chen
  • Publication number: 20030100170
    Abstract: The present invention relates to a fast diffusion recipe for making silicon by NO complexes, which can quicken impurities diffusion by NO complexes, thus reducing effectiveness for a given period of time and cost of production. When it is used to make CMOS well, processing period would be more rapidly. Because of the produced interface depth is affected by ventilation at stage of heat treatment, and obtaining deeper depth by N2O compared with using traditional N2, it is thus clear that this recipe features application and use value.
    Type: Application
    Filed: November 29, 2001
    Publication date: May 29, 2003
    Applicant: Feng-Chia University
    Inventors: Wen-Luh Yang, Don-Gey Liu, Tsong-Jen Yang, Giin-Shan Chen, Kuo Wei Chu
  • Publication number: 20030099849
    Abstract: A method for forming an electrochromic material includes the steps of (a) forming a transparent conductive film on a transparent substrate, (b) forming a metal film on the transparent conductive film by electroless plating, and (c) oxidizing the metal film to form a metal oxide film, which exhibits electrochromic characteristics on the transparent conductive film.
    Type: Application
    Filed: November 21, 2002
    Publication date: May 29, 2003
    Applicant: FENG CHIA UNIVERSITY
    Inventors: Shu-Yii Wu, Wen-Feng Chen