Abstract: Process and apparatus for providing the application of glue on preselected zones of a printed circuit, according to which provision is made for a tank containing liquid glue, and a series of push rods arranged at preselected positions, which first contact the glue in said tank, then deposit the drops of glue on a board for printed circuits.

Abstract: This invention provides a process and apparatus comprising at least one unit to grip a microcomponent arranged at the top opening of a stack of microcomponents inside the magazine according to which the presence of said microcomponent is checked by the gripping members and the electrical efficiency thereof is then tested. The apparatus comprises various units, each of which comprises at least one gripping member to selectively draw and deliver a single microcomponent; a control member to operate said gripping means; a sensor to sense the presence of the microcomponent if positioned in the gripping member which, in case, also carries on measures to check the efficiency thereof. Then, if required, the absence or the presence of a faulty microcomponent is signalled.