Abstract: Disclosed herein are devices, methods, and systems for reading/writing memory cells of a memory, where the memory cells includes a memory element that is writable to at least three different remanent polarization states. A sensing circuit determines, in a read operation, a stored state of the memory element from among the at least three different remanent polarization states based on a sensed change in a remanent polarization of the memory element caused by an applied read voltage. A biasing circuit applies, in a write operation, apply a bias voltage level across the memory element to (re)write the memory element to the stored state.

Abstract: A memory cell arrangement is provided that may include: one or more memory cells, each memory cell of the one or more memory cells including: a field-effect transistor structure; a plurality of first control nodes; a plurality of first capacitor structures, a second control node; and a second capacitor structure including a first electrode connected to the second control node and a second electrode connected to a gate region of the field-effect transistor. Each of the plurality of first capacitor structures includes a first electrode connected to a corresponding first control node of the plurality of first control nodes, a second electrode connected to the gate region of the field-effect transistor structure, and a spontaneous-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure.

Abstract: Various aspects relate to a memory device including: a plurality of gate layer stacks, wherein each gate layer stack of the plurality of gate layer stacks includes a gate electrode layer and one or more electrically insulating layers; one or more channel structures extending through the plurality of gate layer stacks, wherein the plurality of gate layer stacks and the one or more channel structures correspond to a plurality of field-effect transistor based memory cells, wherein each field-effect transistor based memory cell of the plurality of field-effect transistor based memory cells includes: a gate layer portion of a gate layer stack of the plurality of gate layer stacks; a channel portion of a channel structure of the one or more channel structures; a spontaneously-polarizable portion; and a floating gate, wherein the spontaneously-polarizable portion and the floating gate are disposed between the gate layer portion and the channel portion.

Abstract: Disclosed herein is an adaptive voltage regulator that includes a voltage regulator circuit configured to provide a regulated output voltage at an output node of the adaptive voltage regulator circuit. The adaptive voltage regulator also includes an adaptation circuit coupled to the output node that is configured to adapt a charging characteristic associated with a charging of the output node to a predefined output voltage as a function of a load coupled to the output node. The adaption circuit may be configured to selectively provide additional charging current that charges the output node to the predefined output voltage depending on the load.

Abstract: Various aspects relate to a startup circuit for a bandgap reference circuit, wherein a target voltage value is associated with the bandgap reference circuit, the target voltage value being indicative of a startup condition of the bandgap reference circuit that triggers a stable on-state of the bandgap reference circuit, wherein the startup circuit is configured to: provide a startup voltage at the bandgap reference circuit to trigger a start of an operation of the bandgap reference circuit; receive a feedback voltage, wherein the feedback voltage is representative of a startup condition of the bandgap reference circuit; and either increase the startup voltage at the bandgap reference circuit in the case that a voltage value of the feedback voltage is less than the target voltage value, or stop providing the startup voltage at the bandgap reference circuit in the case that the voltage value of the feedback voltage is equal to or greater than the target voltage value.

Abstract: In various aspects, a method for operating a memory cell arrangement is provided, including: providing a set of supply voltages to one or more sets of memory cell drivers to write one or more memory cells of the memory cell arrangement; wherein providing the set of supply voltages includes: ramping a first supply voltage of the set of supply voltages to a first predefined output voltage level, and ramping a second supply voltage of the set of supply voltages to a second predefined output voltage level dependent upon the first supply voltage, the first predefined output voltage level and the second predefined output voltage level defining a first predefined ratio, wherein, during the ramping of the first supply voltage and of the second supply voltage, a first ratio of the first supply voltage to the second supply voltage is substantially equal to or less than the first predefined ratio.

Abstract: Various aspects relate to a functional layer and the formation thereof. A method for manufacturing a functional layer of an electronic device may include: forming a plurality of sublayers of the functional layer by a plurality of consecutive sublayer processes, each sublayer process of the plurality of consecutive sublayer processes comprising: forming a sublayer of the plurality of sublayers by vapor deposition, the sublayer comprising one or more materials, and, subsequently, crystallizing the one or more materials comprised in the sublayer.

Abstract: Various aspects relate to a threshold switch structure and a use of such threshold switch structure as a threshold switch in a memory cell arrangement, the threshold switch structure including: a first electrode, a second electrode, a switch element in direct physical contact with the first electrode and the second electrode, the switch element including a layer of a spontaneously polarizable material. The first electrode, the second electrode, and the switch element are configured to allow for a switching of the switch element between a first electrical conductance state and a second electrical conductance state as a function of a voltage drop provided over the switch element by the first electrode and the second electrode.

Abstract: According to various aspects, a method of forming one or more remanent-polarizable capacitive structures, the method including forming one or more capacitive structures, each of the one or more capacitive structures includes: one or more electrodes, one or more precursor structures disposed adjacent to the one or more electrodes, wherein each of the one or more precursor structures has a first dimension in a range from about 1 nm to 100 nm and a second dimension in a range from about 1 nm to about 30 nm; and, subsequently, forming one or more remanent-polarizable structures comprising a crystalline remanent-polarizable material based on a crystallization of a precursor material of the one or more precursor structures.

Abstract: In various embodiments, a memory cell arrangement is provided including a memory cell driver and one or more memory cells, wherein one or more control nodes of each of the one or more memory cells are electrically conductively connected to one or more output nodes of the memory cell driver. The memory cell driver may include: a first supply node to receive a first supply voltage and a second supply node to receive a second supply voltage, a plurality of input nodes to receive a plurality of input voltages, one or more output nodes, and a logic circuit connected to the first supply node, the second supply node, the plurality of input nodes, and the one or more output nodes, wherein the logic circuit includes one or more logic gates and is configured to connect via the one or more logic gates either the first supply node or the second supply node to the one or more output nodes in response to the plurality of input voltages.

Abstract: Various aspects relate to a memory cell arrangement including: a memory cell including a field-effect transistor structure and a spontaneous-polarizable memory layer; and a control circuit configured to cause a writing of the memory cell by a writing operation, the writing operation including: carrying out a writing sequence including: supplying a write signal set to the memory cell to provide a write voltage drop to bring a threshold voltage of the memory cell into a target range by polarizing the memory layer, and, subsequently, supplying a post-conditioning signal set to the memory cell to provide a post-conditioning voltage drop having opposite polarity with respect to the write voltage drop to change the threshold voltage by partially depolarizing the memory layer; and checking whether the threshold voltage is in the target range, and repeating the writing sequence in the case that the threshold voltage is not in the target range.

Abstract: Various aspects relate to a memory cell including: a field-effect transistor memory structure, wherein a source/drain current through the field-effect transistor memory structure is a function of a gate voltage supplied to a gate of the field-effect transistor memory structure and a memory state in which the field-effect transistor memory structure is residing in; and an access device coupled to the gate of the field-effect transistor memory structure, wherein the access device is configured to control a voltage present at the gate of the field-effect transistor memory structure.

Abstract: Various aspects relate to a memory cell arrangement including: a plurality of spontaneous-polarizable memory cells; and a control circuit configured to cause a writing of one or more first memory cells by a writing operation, wherein the writing operation includes: supplying a write signal set to the plurality of spontaneous-polarizable memory cells to provide a write voltage drop at each of the one or more first memory cells to switch a respective polarization state, the write signal set causing a disturb voltage drop at one or more second memory cells that are not intended to be written, wherein the disturb voltage drop causes a disturb of the one or more second memory cells and maintains a respective polarization state; and wherein the control circuit is further configured to supply a counter-disturb signal set to the plurality of spontaneous-polarizable memory cells, wherein the counter-disturb signal set provides a counter-disturb voltage drop at the one or more second memory cells to at least partially

Abstract: According to various aspects, a memory cell arrangement includes: a first control line and a second control line; a plurality of memory structures disposed between the first control line and the second control line, wherein each memory structure of the plurality of memory structures comprises a third control line, a first memory cell and a second memory cell; wherein, for each memory structure of the plurality of memory structures, the first memory cell and the second memory cell are coupled to each other by the third control line; wherein, for each memory structure of the plurality of memory structures, the first memory cell is coupled to the first control line and the second memory cell is coupled to the second control line.

Abstract: According to various aspects, a memory cell comprise: a first terminal, a second terminal, a third terminal, a fourth terminal, and a fifth terminal to control the memory cell; a first memory element (FeFET1) and a second memory element (FeFET2), the first memory element comprising a first capacitive memory structure electrically connected to the first terminal and a first field-effect transistor structure coupled to the first capacitive memory structure and electrically connected to the third terminal and the forth terminal; the second memory element comprising a second capacitive memory structure electrically connected to the second terminal and a second field-effect transistor structure coupled to the second capacitive memory structure and electrically connected to the third terminal and the fifth terminal.

Abstract: In various aspects, a voltage supply circuit may include a first controlled voltage converter circuit including a first voltage converter and a first control circuit, wherein the first control circuit is configured to receive an input voltage and control the first voltage converter to output a first output voltage having a predefined relationship to the received input voltage; and a second controlled voltage converter circuit including a second voltage converter and a second control circuit, wherein the second control circuit is configured to receive the first output voltage and control the second voltage converter to output a second output voltage having a predefined relationship to the received first output voltage.

Abstract: A memory cell arrangement is provided that may include: one or more memory cells, each of the one or more memory cells including: an electrode pillar having a bottom surface and a top surface; a memory material portion surrounding a lateral surface portion of the electrode pillar; an electrode layer surrounding the memory material portion and the lateral surface portion of the electrode pillar, wherein the electrode pillar, the memory material portion, and the electrode layer form a capacitive memory structure; and a field-effect transistor structure comprising a gate structure, wherein the bottom surface of the electrode pillar faces the gate structure and is electrically conductively connected to the gate structure, and wherein the top surface of the electrode pillar faces away from the gate structure.

Abstract: A memory cell arrangement is provided that may include: one or more memory cells, each memory cell of the one or more memory cells including: a field-effect transistor structure; a plurality of first control nodes; a plurality of first capacitor structures, a second control node; and a second capacitor structure including a first electrode connected to the second control node and a second electrode connected to a gate region of the field-effect transistor. Each of the plurality of first capacitor structures includes a first electrode connected to a corresponding first control node of the plurality of first control nodes, a second electrode connected to the gate region of the field-effect transistor structure, and a spontaneous-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure.

Abstract: A voltage converter circuit may include: a first input node; a second input node; a first output node; a second output node; one or more charge pumps that convert a first input voltage supplied to the first input node up to a first output voltage and convert a second input voltage supplied to the second input node down to a second output voltage; and a control circuit to control the one or more charge pumps according to two operational modes. In the first operation mode, the control circuit supplies the first input voltage to the first input node, leaves the second input node floating, and outputs the first output voltage at the first output node. In the second operation mode, the control circuit supplies the second input voltage to the second input node, leaves the first input node floating, and outputs the second output voltage at the second output node.

Abstract: According to various aspects, a latch-type charge pump may include: an input node and an output node; a first charge storage and a second charge storage coupled in parallel to each other, a first switch coupled to the input node and a second switch coupled to the output node, wherein the first charge storage couples the first switch with the second switch; and a control circuit configured to control the first switch based on a state of the second charge storage, and to control the second switch based on a state of the first charge storage.