Patents Assigned to FET Engineering, Inc.
  • Patent number: 5632878
    Abstract: An electroformed tool that has a uniform air-releasing hole system with high strength and a simple and convenient method to manufacture it has been created. The method includes conducting electroforming by mixing a non-leveling agent with an electrolytic solution and forming an electroformed layer which has a continuous air-releasing hole structure.
    Type: Grant
    Filed: October 17, 1995
    Date of Patent: May 27, 1997
    Assignee: FET Engineering, Inc.
    Inventor: Minoru Kitano
  • Patent number: 5397229
    Abstract: A mold assembly for molding thermoplastic material into a solid thin shell includes a metal mold with an outer surface exposed to a heat source and an inner surface on which thermoplastic material is cast and fused to form a thin layer thermoplastic shell. A plurality of elongated generally planar fins are connected to the outer surface at predetermined spaced areas for transferring heat from the heat source to predetermined spaced areas of the inner surface. The fins are metal sheets, preferably copper, each having a discontinuous flange at one end secured to the outer surface at spaced points along the discontinuous flange. The discontinuous flange is formed by slitting or cutting one end to form spaced projections and then bending adjacent projections in opposite directions generally transversely from the elongated metal sheet. The projections arc secured to the outer surface by TIG welding.
    Type: Grant
    Filed: January 11, 1994
    Date of Patent: March 14, 1995
    Assignee: FET Engineering, Inc.
    Inventor: Minoru Kitano