Abstract: A microminiaturized antenna feed module includes a substrate, a plurality of coupled feed portions, and an active circuit. The substrate defines a plurality of visa penetrating the substrate. The coupled feed portions, made of conductive material and have different coupling areas, are electrically connected to the active circuit through the holes, to feed in electrical signals, the coupled feed portions couple the electrical signals to the metal frame to radiate wireless signals; the active circuit controls the switching of radiation modes of the metal frame. The application also provides an electronic device with the microminiaturized antenna feed module.

Abstract: An antenna structure includes a housing, a first feed source, a second feed source, and a resonance circuit. The housing includes a first and a second radiator spaced to each other and grounded. The first feed source feeds current into the first radiator to activate a first mode, a second mode, and a third mode to generate radiation signals in a first frequency band, a second frequency band, and a third frequency band. The second feed source feeds current into the second radiator to activate a fourth mode to generate radiation signals in a fourth frequency band. The resonance circuit adjusts a radiation frequency band of the second radiator according to an impedance of the resonance circuit. The first radiator adjusts the third mode according to the radiation frequency band of the second radiator. A wireless communication device employing the antenna structure is also provided.

Abstract: An electronic device includes a metal frame, a middle frame, and at least one antenna feed module. The metal frame includes an upper metal frame, a first side metal frame, a bottom metal frame, and a second side metal frame sequentially connected. The middle frame, spaced apart from the first side metal frame and the second side metal frame, forms a slit, the at least one antenna feed module is received in the slit.

Abstract: An antenna coupled feed module is received in a slit formed between a metal frame and at least one electronic component of an electronic device. The antenna coupled feed module includes a substrate, at least one coupled feed portion, an active circuit, a metal layer, and a non-conductive layer. The coupled feed portion and the active circuit are disposed on opposite surfaces of the substrate; the coupled feed portion couples the electrical signals to the metal layer, the metal layer conducts the electrical signals to the metal frame to radiate wireless signals; the non-conductive layer is arranged between the metal layer and the at least one coupled feed portion, and covers the coupled feed portion; the active circuit switches the electrical signals fed to the coupled feed portion. An electronic device with the antenna coupled feed module is also provided.

Abstract: An antenna structure includes a substrate and a plurality of radiation units, each radiation unit comprising a first radiator and a second radiator. The first radiator is positioned on a first surface of the substrate and includes a first radiation portion and a feed point. The feed point is electrically connected to the first radiation portion for feed current and signals to a corresponding radiation unit. The second radiator is positioned at a second surface of the substrate and is symmetrical with the first radiator about the substrate. The second radiator includes a second radiation portion and a ground portion. The ground portion is electrically connected to the second radiation portion to provide grounding for the radiation unit. The antenna structure has a good radiation efficiency and good isolation between radiators to reduce cross-interference.

Abstract: An antenna structure includes a frame portion and a feeding portion. The frame portion is provided with a first gap and a second gap. The first gap and the second gap penetrate and divide the frame portion into a first radiating portion, a second radiating portion, and a third radiating portion. The feeding portion is arranged on the first radiating portion adjacent to the second gap. One end of the feeding portion is electrically coupled to the first radiating portion, and the other end of the feeding portion is electrically coupled to a feeding point to feed current to the first radiating portion. The second radiating portion and/or the third radiating portion is provided with a side slot. A radiation frequency band of the second radiating portion and/or the third radiating portion where the side slot is located is adjusted by adjusting the length of the side slot.

Abstract: An antenna structure with wide radiation bandwidth includes a first radiation portion, a ground portion, a connection portion, a second radiation portion, and a feed portion. The ground portion is positioned at a plane perpendicular to plane of the first radiation portion. The ground portion is grounded. The connection portion connects to one side of the first radiation portion. The second radiation portion connects to one side of the connection portion away from the first radiation portion. The feed portion is electrically connected to the connection portion and the second radiation portion for feeding current and signals to the antenna structure.

Abstract: An anti-loosing structure includes a first buckle element and a second buckle element. The first buckle element has a first substrate and a clamping portion disposed on the first substrate. The second buckle element has a second substrate, an embedding portion disposed on the second substrate, and an anti-loosing block. The embedding portion is made of an elastic material, the anti-loosing block is movably disposed in the embedding portion, and is configured to cause the embedding portion to be elastically expanded. The embedding portion is configured to be inserted into the clamping portion, causing the embedding portion to connect to the clamping portion by interference fitting.

Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.

Abstract: An assembly line apparatus for the automatic application of different types of labels or cushions or glue (“stickers”) on a workpiece has a transportation device, a plurality of application devices, a central control device, and a first expansive cooperation device. The central control device has first and other communication ports which may each function in accordance with different protocols and standards. The central control device is electronically connected to the transportation device via the first communication port and electronically connected to the application devices via a second or further communication ports. The first expansive cooperation device generates first and second control signals to instruct, via the central control device, the transportation device to move or to stop and to the application devices to apply or not to apply certain stickers on a certain area of a workpiece.

Abstract: A housing for an electronic device includes a metal member combined with a plastic member. The combination molds the metal member to the plastic member but the plastic member is discontinuous and recesses and protrusions are cut into the metal member to enable molding and bonding with the plastic member in the manner of a dovetail joint. Manufacture in this way increases bonding strength and reduces the likelihood of internal stresses in the cooling plastic member resulting from complete envelopment of the metal by the plastic. The metal member and the plastic member are thus integrally formed and a thickness of a recess is less than a thickness of the plastic member. An electronic device and a method for making the housing are also provided.

Abstract: A housing of plastic strongly bonded to a metal frame is integrally formed as the housing of an electronic device. The metal frame includes at least one plastic grabbing recess to receive portion of a plastic member, an opening of the plastic grabbing recess carries convex teeth, the convex teeth narrow the opening of the plastic grabbing recess, and the convex teeth lock portions of the plastic member.

Abstract: A housing of metal combined with plastic used for an electronic device includes a metal frame and a plastic connecting member. The metal frame comprises a middle frame portion, an inner surface of the middle frame portion forming at least one metal rib. The plastic connecting member comprises a plastic base portion formed on one side surface of the metal rib, and the plastic base portion and the metal rib together form a reinforcing bar to greatly increase a strength of the finished housing.

Abstract: A durable and compositely-integral housing of metal and plastic used for an electronic device includes a metal frame and a plurality of plastic filling members. The metal frame defines preset positions, and the preset positions have plastic-receiving notches. The plastic filling members are injection-molded into the notches for better adhesion and bond strength.

Abstract: A shielding box configured for regulating a transmission distance of a radio frequency (RF) signal of an electronic device is used as a container of the electronic device. The shielding box includes a box body. The box body includes a wave-absorbing layer, a first metal layer, a conductive fabric layer, a second metal layer, and a third metal layer in that order from inside to outside. An RF signal attenuation system and method are also provided.

Abstract: A composite toughened against chipping during machining and other operations includes a substrate and a coating layer includes a substrate and a coating layer. The substrate is titanium or titanium alloys. Nano-holes are formed on a surface of the substrate. The coating layer completely fills in the nano-holes and completely covers the surface of the substrate where the nano-holes are not formed. The disclosure further provides a method for making such composite.

Abstract: A method of making a housing includes: providing a substrate and cutting the substrate to form an opening. The substrate being spaced by the opening to form at least one main base. A plurality of metal sheets and a plurality of reinforcing members are provided. Placing the metal sheets, the reinforcing members and the main base into a mold. The metal sheets is positioned in the opening, adjusts width of each gap between adjacent metal sheets, and between the main base and one metal sheet adjacent to the main base. Locating the reinforcing members in the metal sheets and the main base. Liquid resin is filled into the gaps and covers the reinforcing members to bond the metal sheets, the main base and the reinforcing members together, forming the housing.

Abstract: An assembly line apparatus for the automatic application of different types of labels or cushions or glue (“stickers”) on a workpiece has a transportation device, a plurality of application devices, a central control device, and a first expansive cooperation device. The central control device has first and other communication ports which may each function in accordance with different protocols and standards. The central control device is electronically connected to the transportation device via the first communication port and electronically connected to the application devices via a second or further communication ports. The first expansive cooperation device generates first and second control signals to instruct, via the central control device, the transportation device to move or to stop and to the application devices to apply or not to apply certain stickers on a certain area of a workpiece.

Abstract: A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

Abstract: A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.