Patents Assigned to Filtronic Compound Semiconductor Ltd.
  • Semiconductor wafer handling method
    Patent number: 6846698
    Abstract: A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process. The method includes the steps of attaching a flexible connected layer to a semiconductor wafer layer mounted on a carrier substrate and separating the wafer layer from the carrier substrate while supported by the flexible connected layer.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: January 25, 2005
    Assignee: Filtronic Compound Semiconductor Ltd.
    Inventors: Matthew Francis O'Keefe, John Melvyn Cullen