Patents Assigned to Fin-Core Corporation
  • Patent number: 8547003
    Abstract: A heat-dissipating module includes a plurality of cooling fins arranged radially, spaced apart from each other, and connected annularly in a manner that a hollow core is formed centrally in the heat-dissipating module. The cooling fins each bend at a preset position thereof and in a first direction, such that the cooling fins each include a first flap and a second flap. The first flap and the second flap together form a preset included angle therebetween.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: October 1, 2013
    Assignee: Fin-Core Corporation
    Inventor: Wei Chung Wu