Patents Assigned to Fine Device Co., Ltd.
  • Patent number: 8038828
    Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: October 18, 2011
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fine Device Co., Ltd., Laser X Company, Ltd.
    Inventors: Masaki Terada, Akihiko Tsuboi, Seijirou Soeda, Jun Hayakawa, Kyouji Kokufuda, Tsuyoshi Tanigaki
  • Patent number: 7510620
    Abstract: A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: March 31, 2009
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fine Device Co., Ltd., Laser X Co., Ltd.
    Inventors: Masaki Terada, Akihiko Tsuboi, Seijirou Soeda, Jun Hayakawa, Kyouji Kokufuda, Tsuyoshi Tanigaki
  • Patent number: 6696668
    Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: February 24, 2004
    Assignees: Fine Device Co., Ltd., Japan Unix Co., Ltd.
    Inventor: Jun Hayakawa
  • Publication number: 20010054637
    Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.
    Type: Application
    Filed: April 12, 2001
    Publication date: December 27, 2001
    Applicant: Fine Device Co., Ltd.
    Inventor: Jun Hayakawa